关键词: 单晶铜, 切削性能, 纳米切削, 分子动力学

Abstract:

The surface cutting properties of single crystal copper material were researched by using molecular dynamics simulation. Through molecular dynamics modeling, calculation and analysis, the influences of different cutting speeds or  cutting thicknesses on single crystal copper surface nano-cutting process microscopic atomic states and the change rule of contact area cutting force were studied.The results show that the accumulated volume of chips increases with the cutting speed increases in nano-cutting process of single crystal copper surface,at the same time the atoms in the chip stack are tighter and the distribution of dislocation defects is wider.The accumulated volume of chips in front of tool and the dislocation defects increase with the cutting thickness increases in a same cutting speed. In different cutting speeds or cutting thicknesses,the cutting force will rise at first, and float around a stable value after reaching a steady stage. During initial stage of cutting, the higher the cutting speed or cutting thickness, the larger rise range of cutting force. After reaching the steady stage of cutting, the higher the cutting speed or cutting thickness, the larger cutting force.

Key words: single crystal copper, cutting property, nano-cutting, molecular dynamics