China Mechanical Engineering ›› 2023, Vol. 34 ›› Issue (13): 1559-1567.DOI: 10.3969/j.issn.1004-132X.2023.13.005

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Experimental Study of Laser Assisted Water Jet Micromilling of Single Crystal β-Ga2O3 Substrates

TIAN Long1;HUANG Chuanzhen2;LIU Dun 1;YAO Peng 1;LIU Hanlian1;LIU Xuefei1   

  1. 1.Center for Advanced Jet Engineering Technologies (CaJET),Key Laboratory of High-efficiency  and Clean Mechanical  Manufacture (Ministry of Education),National Experimental Teaching Demonstration Center for Mechanical Engineering (Shandong University),School of Mechanical Engineering,Shandong University,Jinan,250061 2.School of Mechanical Engineering,Yanshan University,Qinhuangdao,Hebei,066004
  • Online:2023-07-10 Published:2023-07-24

激光辅助水射流微铣削单晶β-Ga2O3衬底的实验研究

田龙1;黄传真2;刘盾1;姚鹏1;刘含莲1;刘雪飞1   

  1. 1.先进射流工程技术研究中心,高效清洁机械制造教育部重点实验室,机械工程国家级实验教学示范中心(山东大学),山东大学机械工程学院,济南,250061
    2.燕山大学机械工程学院,秦皇岛,066004
  • 通讯作者: 黄传真(通信作者),男,1966年生,教授、博士研究生导师。研究方向为高效精密加工技术、结构陶瓷材料研制及应用、新材料加工技术。E-mail:huangchuanzhen@ysu.edu.cn。
  • 作者简介:田龙,男,1998年生,硕士研究生。研究方向为特种加工。E-mail:2277892397@qq.com。
  • 基金资助:
    河北省全职引进国家高层次创新型人才科研项目(2021HBQZYCXY004)

Abstract:  Gallium oxide (β-Ga2O3) was a new type of high performance semiconductor material. Due to the characteristics of easy cleavage, high brittleness, poor thermal conductivity and anisotropy, the micro cracks would be easily generated in traditional precision machining and laser machining, which greatly restricted the applications of gallium oxide single crystal. Laser-assisted water jet machining might combine the advantages of high efficiency and high precision of laser machining and no thermal damages of water jet machining, which might realize the near thermal damage free machining of hard and brittle materials, thus a good application prospect was obtained in the field of semiconductor wafer processing. All-factor experimental study of laser assisted water jet micro-milling of single crystal β-Ga2O3 substrates was carried out herein. Results show that the processing parameters have significant influences on the depth and the surface roughness of the bottom of the micro-groove. By optimizing the processing parameters, the micro-groove with low surface damage, flat bottom and low surface roughness (Ra<1 μm) may be obtained by the laser assisted water jet machining. 

Key words:  , gallium oxide substrate, laser assisted water jet, micro milling, surface roughness

摘要: 氧化镓(β-Ga2O3)是一种新型高性能半导体材料,由于其易解理、高脆性、导热性差和各向异性等特点,在传统的精密加工和激光加工过程中易产生微裂纹,这极大地制约了氧化镓单晶的应用。激光辅助水射流加工集成了激光加工效率高、精度高以及水射流加工不产生热损伤的优势,能实现硬脆材料的近无热损伤加工,在半导体晶圆加工领域具有良好的应用前景。对激光辅助水射流微铣削单晶β-Ga2O3衬底进行了全因素实验研究,结果表明,工艺参数对微槽深度和微槽底部表面粗糙度具有显著影响,通过工艺参数优化,激光辅助水射流加工能获得低表面损伤、底部平整且表面粗糙度低(Ra<1 μm)的微槽。

关键词: 氧化镓衬底, 激光辅助水射流, 微铣削, 表面粗糙度

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