甲基乙烯基磨料流抛光介质的研制及性能分析

doi:10.3969/j.issn.1004-132X.2026.08.013

摘要/Abstract

摘要：

以甲基乙烯基硅橡胶为基体，添加二甲基硅油、碳化硅（SiC）磨料等，研制了一种新型磨料流抛光介质，并系统评估其流变性能与加工效果。通过微观形貌分析与流变测试（蠕变柔量、应力松弛、动态模量扫描），主要研究了介质组分对其黏弹性行为的影响，发现提高加工油含量可增强流动性，但过量（大于20%）会导致弹性下降，介质二（30%基体、20%加工油、45%SiC、5%热稳定剂）在宽频范围内（86.9~628 rad/s）表现出弹性主导（ $G'$ >G''），且剪切稀化特性显著，适配高剪切抛光工况。与丁苯橡胶基介质对比，甲基乙烯基抛光介质展现出更优的耐热稳定性、耐磨性及壁面黏附性能。将新型介质用于螺杆抛光加工试验，结果表明：相同参数下，甲基乙烯基抛光介质使螺杆表面粗糙度Sa的降幅为89.23%，优于丁苯抛光介质的Sa降幅74.71%。

关键词: 甲基乙烯, 抛光介质, 磨料流加工, 流变性能, 表面粗糙度

Abstract:

A novel abrasive flow polishing medium is developed using methyl vinyl silicone rubber as the matrix， with the addition of dimethyl silicone oil， silicon carbide （SiC） abrasives， and other components. The rheological properties and machining performance of the medium are systematically evaluated. Through micro-morphology analysis and rheological testing （including creep compliance， stress relaxation， and dynamic modulus scanning）， the effects of the medium components on its viscoelastic behavior are investigated. Increasing the machining oil content enhances the fluidity， but an excessive amount （>20%） leads to a decrease in elasticity. Medium II （30% matrix， 20% machining oil， 45% SiC， and 5% thermal stabilizer） exhibits elasticity-dominant behavior （ $G'$ >G''） over a wide frequency range （86.9‒628 rad/s） and shows significant shear-thinning characteristics， making it suitable for high-shear polishing conditions. Compared with the styrene-butadiene rubber-based medium， the methylvinyl polishing medium demonstrated superior thermal stability， wear resistance， and wall adhesion properties. The new medium is applied to screw polishing machining tests， and the results show that under tidentical parameters， the methyl vinyl polishing medium achieves an 89.23% improvement in surface roughness Sa of the screw， outperforming the 74.71% improvement rate of the styrene-butadiene polishing medium.

Key words: methyl vinyl, polishing medium, abrasive flow machining（AFM）, rheological property, surface roughness

中图分类号:

TG580

曹伟婷, 文东辉, 蔡姚杰. 甲基乙烯基磨料流抛光介质的研制及性能分析[J]. 中国机械工程, 2026, 37(8): 1937-1946.

CAO Weiting, WEN Donghui, CAI Yaojie. Development and Performance Analysis of Methyl Vinyl Abrasive Flow Polishing Media[J]. China Mechanical Engineering, 2026, 37(8): 1937-1946.

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链接本文: https://www.cmemo.org.cn/CN/10.3969/j.issn.1004-132X.2026.08.013

https://www.cmemo.org.cn/CN/Y2026/V37/I8/1937

图/表 24

图1 甲基乙烯基分子链结构

Fig.1 Methyl vinyl molecular chain structure

图2 基体与加工油之间的分子作用力［12］

Fig.2 Molecular forces between matrix and processing oil［12］

表1 碳化硅磨料物理性能

Tab.1 Physical properties of silicon carbide abrasives

密度/（g·cm $- 3$ ）	弹性模量/GPa	显微硬度/HV	熔点/℃
3.22	192	2840~3320	2700

表1 碳化硅磨料物理性能

Tab.1 Physical properties of silicon carbide abrasives

密度/（g·cm $- 3$ ）	弹性模量/GPa	显微硬度/HV	熔点/℃
3.22	192	2840~3320	2700

图3 甲基乙烯基抛光介质成分与制备

Fig.3 Preparation and composition of a new polishing medium

图4 超景深图

Fig.4 Deep focus microscopy image

图5 SEM图

Fig.5 SEM image

图6 交界处2的线扫EDS表征

Fig.6 Line-scan EDS characterization at interface region 2

图7 抛光介质加工机理［12］

Fig.7 Material removal mechanism of polishing media［12］

表2 不同成分的甲基乙烯基磨料流抛光介质

Tab.2 Methyl vinyl abrasive flow polishing media with different compositions

介质	介质成分/%
介质	基体	加工油	磨粒SiC	热稳定剂
介质一	40	10	45	5
介质二	30	20	45	5
介质三	20	30	45	5
介质四	10	40	45	5

图8 四种介质基于振荡扫描测试的线性黏弹性区间试验（应力）

Fig.8 Determination of linear viscoelastic region for four media via oscillatory stress sweep tests

图9 蠕变柔量随时间的变化

Fig.9 Time-dependent variation of creep compliance

图10 四种介质基于振荡扫描测试的线性黏弹性区间试验（形变）

Fig.10 Linear viscoelastic interval test based on oscillation scanning test for four media（deformation）

图11 四种介质的松弛模量随时间的变化

Fig.11 Changes in relaxation modulus of four media over time

图12 四种介质的储能模量和耗能模量随角频率的变化

Fig.12 Changes in storage modulus and energy dissipation modulus of four media with angular frequency

图13 试验装置及流道示意图

Fig.13 Schematic diagram of experimental apparatus and flow channel

图14 两种抛光介质壁面黏附

Fig.14 Wall adhesion of two polishing media

图15 甲基乙烯基抛光介质与丁苯抛光介质耐热稳定性测试

Fig.15 Thermal stability testing of methyl vinyl polishing medium and styrene butadiene polishing medium

图16 甲基乙烯基磨料流介质与丁苯抛光介质用前后动态频率扫描测试

Fig.16 Dynamic frequency sweep tests before and after use for methyl vinyl abrasive flow medium and styrene-butadiene polishing medium

图17 螺杆挤压加工原理

Fig.17 Working principle of screw extrusion processing

图18 螺杆几何结构

Fig.18 Geometric structure of screw

表3 试验参数

Tab.3 Test parameters

抛光介质	甲基乙烯基抛光介质	丁苯抛光介质
入口压力/MPa	3	3
螺杆转速/（r·min^-1）	120	120
加工时间/min	100	100
磨料粒径	240#	240#

表4 两种介质加工前后Sa改善率

Tab.4 Improvement rate of Sa before and after processing with two different media

时间/ min	抛光初始 Sa/nm	甲基乙烯基抛光介质抛光后Sa/nm	丁苯抛光介质抛光后Sa/nm	甲基乙烯基抛光介质的改善率/%	丁苯抛光介质的改善率/%
25	Sa_methyl=362.14 Sa_styrene=340.36	97.46	132.37	73.20	61.11
50		69.24	114.76	80.88	66.28
75		50.12	100.52	85.27	70.47
100		39.45	86.26	89.23	74.71

表5 两种介质加工前后Sz改善率

Tab.5 Improvement rate of Sz before and after processing with two different media

时间/ min	抛光初始 Sz/nm	甲基乙烯基抛光介质抛光后Sz/nm	丁苯抛光介质抛光后Sz/nm	甲基乙烯基抛光介质改善率/%	丁苯抛光介质改善率/%
25	Sz_methyl=2777.34 Sz_styrene=2663.56	1065	1036	61.65	61.10
50		745	923	73.17	65.34
75		634	837	77.17	68.57
100		459	709	83.58	73.37

图19 两种介质加工前后工件表面三维轮廓变化

Fig.19 3D surface topography changes of workpiece before and after processing with two media

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