[1]Willems B, Dewulf W, Duflou J. Design for Active Disassembly(DFAD): an Outline for Future Researeh[C]//Proceedings of the 2005 IEEE International Symposium on Electronics & the Environment. New Oleans,LA,USA,2005 : 129-134.
[2]Chiodo J D,Boks C. Assessment of End-of-life Strategies with Active Disassembly Using Smart Materials[J]. The Journal of Sustainable Product Design,2002(2) :69-82.
[3]Chiodo J D, McLaren J,Billett E H, et al. Isolating LCD's at End-of-life Using Active Disassembly Technology:a Feasibility Study[C]//2000 IEEE International Symposium on Electronics and the Environment. San Francisco, CA, USA, 2000 : 318-323.
[4]Chiodo J D. Design Principles for Active Disassembly Initial Findings [ R]. Active Disassembly Research Ltd.
[5]Chiodo J D,Jones N,Billett E H ,et al. Shape Memory Alloy Actuators for Active Disassembly Using 'Smart' Materials of Consumer Electronic Products [J]. Materials and Design, 2002,23 ( 11 ) : 471-478.
[6]Torres F, GIL P, Puente S T, et al. Automatic PC Disassembly for Component Recovery[J]. International Journal of Advanced Manufacturing Technology, 2004,23(1/2) : 39-46.
[7]Chiodo J D,Billett E H, Harrison D J. Active Disas-sembly by Using Shape Memory Polymers for the Mobile Phone Industry[C]//1999 IEEE International Symposium on Electronics and the Environment. Washington D C, USA, 1999: 151-156.
[8]刘志峰[1],李新宇[1],张洪潮[1,2].基于智能材料主动拆卸的产品设计方法[J].机械工程学报,2009,45(10):192-197.
[9]刘鸿文.材料力学[M].北京:高等教育出版社,1997.
[10]徐祖耀等著.形状记忆材料[M],2000:441.
[11]李新宇.基于智能材料的主动拆卸结构设计理论与方法研究 [D].合肥工业大学,2008: |