Interface Quality Detection of Double-layer Bonding Structures Based on Ultrasonic Guided Wave Technology

doi:10.3969/j.issn.1004-132X.2024.05.017

Abstract

Abstract: A ultrasonic guided wave detection method was proposed to address the difficulty in detecting the interface quality of adhesive structures. Based on the spring model and wave equation, the mathematical model of ultrasonic guided wave propagation in the double-layer bonding structure was established, and the dispersion equations of different bonding interfaces were obtained. The dispersion characteristics of different bonding interfaces were obtained by solving the equations. The propagation processes of sound waves at different adhesive interfaces were simulated using COMSOL software. The simulation results show that under the condition of 1 MHz frequency rigid bonding, the group velocity numerically solved is as 4.632 km/s, and the simulated mean group velocity is as 4.505 km/s, with error of 2.74%. Under the condition of slip bonding, the numerical solution group velocity is as 4.855 km/s, and the simulation mean group velocity is as 5.045 km/s, with error of 3.91%. Under the condition of complete debonding, the dispersion curve of the double-layer adhesive structure is the superposition of the single-layer dispersion curve. Through the analysis of the experimental detection results of ultrasonic guided waves in double-layer media, it is found that the experimental results are in good agreement with the numerical solution and finite element simulation ones, which verifies the correctness of the theoretical model.

Key words: bonded structure, spring model, dispersion equation, finite element simulation, group velocity

摘要： 针对粘接结构界面质量难以检测的问题，提出一种超声导波检测技术方法。基于弹簧模型和波动方程建立超声导波在双层粘接结构中传播的数学模型，获得不同粘接界面的频散方程，通过求解该方程获得不同粘接界面的频散特性。利用COMSOL软件模拟了声波在不同粘接界面的传播过程。仿真结果表明，在频率为1 MHz时刚性粘接条件下，数值求解的群速度为4.632 km/s，仿真平均群速度为4.505 km/s，误差为2.74%；在滑移粘接条件下，数值求解的群速度为4.855 km/s，仿真平均群速度为5.045 km/s，误差为3.91%；在完全脱粘条件下，双层粘接结构频散曲线为单层频散曲线的叠加。通过对双层介质超声导波实验检测结果的分析，发现实验结果与数值求解和有限元仿真结果吻合较好，验证了该理论模型的正确性。

关键词: 粘接结构, 弹簧模型, 频散方程, 有限元仿真, 群速度

CLC Number:

TB553

WU Hui, LI Xiaogao, SHEN Guolang, WANG Xinguo, MA Chenwen. Interface Quality Detection of Double-layer Bonding Structures Based on Ultrasonic Guided Wave Technology[J]. China Mechanical Engineering, 2024, 35(05): 916-927.

吴慧, 李晓高, 沈国浪, 王兴国, 马成文. 基于超声导波技术的双层粘接结构界面质量检测[J]. 中国机械工程, 2024, 35(05): 916-927.

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