Adjustment of Thickness Uniformity for Precision Electroformed Mold Insert

doi:10.3969/j.issn.1004-132X.2023.21.002

Abstract

Abstract: In electroforming processes， the nonuniform distribution of electric field at cathode edge led to a higher deposition rate at the edge， which resulted in the nonuniform thickness of electroformed mold insert. A cathode fixture with side grooves on top of the shielding baffle was designed herein. The research results show that the nonuniformity is as 4.3% with the thickness of electrodeposited layer is as 0.1 mm， which is the 16.5% of the nonuniformity without shielding plate. The precision injection mold insert with a thickness of 1.1 mm and thickness nonuniformity less than 8% was successfully fabricated based on the cathode side groove and shielding baffle.

Key words: , electroforming, thickness nonuniformity, shielding baffle, cathode side groove, injection mold insert

摘要： 阴极边缘的电场分布不均匀导致模芯边缘的沉积速率高，严重降低电铸模芯的厚度均匀性。在屏蔽挡板工艺基础上，创新性地设计了具有侧边凹槽的阴极夹具。研究表明，沉积层厚度为0.1 mm时，采用该阴极夹具，在屏蔽挡板情况下的厚度不均匀性仅为4.3%，在无屏蔽挡板情况下的厚度不均匀性为16.5%。基于屏蔽挡板和侧边凹槽屏工艺，电铸成形了厚度1.1 mm、不均匀性小于8.0%的精密注射模芯。

关键词: 电铸, 厚度不均匀性, 屏蔽挡板, 侧边凹槽, 注射模芯

CLC Number:

TQ153.4

YANG Zhonghao, JIANG Bingyan, MA Zhigao, YANG Di, ZHANG Lu, . Adjustment of Thickness Uniformity for Precision Electroformed Mold Insert[J]. China Mechanical Engineering, 2023, 34(21): 2531-2539.

杨忠豪, 蒋炳炎, 马志高, 杨迪, 张露, . 精密电铸模芯厚度均匀性的调控[J]. 中国机械工程, 2023, 34(21): 2531-2539.

References

［1］ROTHBAUER M， ZIRATH H， ERTL P. Recent Advances in Microfluidic Technologies for Cell-to-cell Interaction Studies［J］. Lab on a Chip， The Royal Society of Chemistry， 2018， 18（2）：249-270.
［2］SHACKMAN J G， DAHLGREN G M， PETERS J L， et al. Perfusion and Chemical Monitoring of Living Cells on a Microfluidic Chip［J］. Lab on a Chip， The Royal Society of Chemistry， 2005， 5（1）：56-63.
［3］满佳，华泽升，夏荷，等. 微流控技术在机械工程-生命科学交叉领域的应用［J］. 中国机械工程， 2022， 33（15）：1857-1868.
MAN Jia， HUA Zesheng， XIA He， et al. Applications of Microfluidic Technology in Cross-domain of Mechanical Engineering and Life Science［J］. China Mechanical Engineering， 2022， 33（15）：1857-1868.
［4］MAGHSOUDI K， JAFARI R， MOMEN G， et al. Micro-nanostructured Polymer Surfaces Using Injection Molding：a Review［J］. Materials Today Communications， 2017， 13：126-143.
［5］SALAFI T， ZHANG Y， ZHANG Y. A Review on Deterministic Lateral Displacement for Particle Separation and Detection［J］. Nano-Micro Letters， 2019， 11（1）：77.
［6］ZHANG H， ZHANG N， GILCHRIST M， et al. Advances in Precision Micro/Nano-electroforming：a State-of-the-Art Review［J］. Journal of Micromechanics and Microengineering， 2020， 30（10）：103002.
［7］朱和卿，吕辉，赵雯，等. 金属微通道散热器结构微电铸均匀性研究［J］. 电加工与模具， 2019（1）：43-48.
ZHU Heging， LYU Hui， ZHAO Wen， et al. Study on Micro-electroforming Uniformity of Metal Micro-Channel Radiator Structure［J］. Electromachining & Mould， 2019（1）：43-48.
［8］曾永彬，朱荻，曲宁松，等. 活动屏蔽膜板高深宽比微细电铸技术研究［J］. 中国机械工程， 2008， 29（12）：1457-1461.
ZENG Yongbin， ZHU Di， QU Ningsong， et al. Research on Micro Electroforming Technology of High-aspect-ratio Metal Microstructures by Usinga Movable Mask［J］. China Mechanical Engineering， 2008， 29（12）：1457-1461.
［9］HAN Lianhuan， MATTHEW M S， TIAN Zhongqun， et al. Electrochemical Nanomachining［J］. Current Opinion in Electrochemistry， 2020， 22：80-86.
［10］DU Liqun， YANG Tong， ZHAO Ming， et al. Study on Improving Thickness Uniformity of Microfluidic Chip Mold in the Electroforming Process［J］. Micromachines， 2016， 7（1）：7.
［11］吕辉，徐腾飞，刘佳，等. 辅助阴极对电铸微模芯厚度均匀性的影响［J］. 电镀与涂饰， 2014， 33（17）：732-736.
LYU Hui， XU Tengfei， LIU Jia， et al. Effect of Auxiliary Cathode on Thickness Uniformity of Micro-electroformed Mold Insert［J］. Electroplating & Finishing， 2014， 33（17）：732-736.
［12］VOLGINV M， LYUBIMOVV V， GNIDINAI V， et al. Effect of Anode Shape on Uniformity of Electrodeposition onto Resistive Substrates［J］. Electrochimica Acta， 2017， 230：382-390.
［13］马鑫，蒋炳炎，陈中原，等. 屏蔽挡板对电铸微模芯厚度均匀性的影响［J］. 电镀与环保， 2014， 34（5）：8-11.
MA Xin， JIANG Bingyan CHEN Zhongyuan， et al， Effects of Non-conducting Shield on Thickness Uniformity of Micro-electroformed Mold Insert［J］. Electroplating & Pollution Control， 2014， 34（5）：8-11.
［14］陈晖，汪红，李光杨，等. 水平与垂直流动对微电铸镀层均匀性的影响［J］. 传感器与微系统， 2011， 30（6）：20-23.
CHEN Hui， WANG Hong， LIGuangyang， et al. Influence of Horizontal and Vertical Flow Pattern on Coating Uniformity inside Micro-structures during Electrodeposition［J］. Transducer and Microsystem Technologies， 2011， 30（6）：20-23.
［15］CAO Q D， FANG L， LYU J M， et al. Effects of Pulse Reverse Electroforming Parameters on the Thickness Uniformity of Electroformed Copper Foil［J］. Transactions of the IMF， 2018， 96（2）：108-112.
［16］杜立群，杨彤，赵明，等. 超声电铸提高金属微流控芯片模具的均匀性［J］. 强激光与粒子束， 2016， 28（6）：63-67.
DU Liqun， YANG Tong， ZHAO Ming， et al. Improvement of Microfluidic Chip Mould Thickness Uniformity by Ultrasonic Agitation during Electroforming Process［J］. High Power Laser and Particle Beams， 2016， 28（6）：63-67.
［17］LI J， ZHANG P， WU Y， et al. Uniformity Study of Nickel Thin-film Microstructure Deposited by Electroplating［J］. Microsystem Technologies， 2009， 15（4）：505-510.
［18］PARK C W， PARK K Y. An Effect of Dummy Cathode on Thickness Uniformity in Electroforming Process［J］. Results in Physics， 2014， 4：107-112.
［19］ZHAO Ming， DU Liqun， WEI Zhuangzhuang， et al. Fabrication of Metal Microfluidic Chip Mold with Coplanar Auxiliary Cathode in the Electroforming Process［J］. Journal of Micromechanics and Microengineering， 2019， 29（2）：025002.
［20］ZHANG H， ZHANG N， FANG F. Study on Controllable Thickness and Flatness of Wafer-scale Nickel Shim in Precision Electroforming Process：Simulation and Validation［J］. Journal of Manufacturing Science and Engineering， 2021， 143（11）：111005.
［21］QIAO F， SUN X， WEST A C. A Shielded Rotating Disk Setup with Improved Current Distribution［J］. Journal of Applied Electrochemistry， 2014， 44（8）：945-952.

[1]	MIN Delei, TONG Ruting, WEI Yintao. Yaw Rate Calculation and Vehicle Stability Control Considering Tire Nonlinearity [J]. China Mechanical Engineering, 2023, 34(21): 2521-2530.
[2]	XU Jilong, LIU Fucai, NIU Yunzhan. Design and Analysis of a Novel Weak-coupling Parallel Hip Exoskeleton with Large Angle of Rotation [J]. China Mechanical Engineering, 2023, 34(21): 2540-2547.
[3]	REN Yongsheng, YAO Donghui, ZHANG Jinfeng. Research Advances in Chatter of Metal Cutting Systems Involving Time Delays [J]. China Mechanical Engineering, 2023, 34(21): 2548-2567,2576.
[4]	CHEN Qinghua, LYU Ke, WANG Dejun, WANG Jiangang, WANG Jianye, FENG Peng. Performance of Functional Gradient Explosion-proof Structures of Experimental Cabin under Explosive Loading [J]. China Mechanical Engineering, 2023, 34(21): 2568-2576.
[5]	ZHU Zongming, JI Suqiang, WANG Hao, TANG Puhua, LIANG Liang. Hemodynamics Analysis of Interventional Robots in Diagnosis and Treatment Based on Fluid-structure Interaction [J]. China Mechanical Engineering, 2023, 34(21): 2592-2599.
[6]	XU Wan, CHENG Zhao, XIA Ruidong, CHEN Hancheng. An Adaptive Robust Unscented Kalman Filter Localization Algorithm Based on Dynamic Residual [J]. China Mechanical Engineering, 2023, 34(21): 2607-2614.
[7]	LIU Jie, JIAN Linjie, DOU Zecheng, WEN Guilin, WANG Ruikun, LI Fangyi. On Sound Absorption Characteristics of Lightweight Structures Constructed by UMPPs [J]. China Mechanical Engineering, 2023, 34(20): 2395-2402.
[8]	ZHU Jiangfeng, CAO Yuguang, ZHAO Qiankun, LI Lei. Study on Hydrodynamic Stability of a Dot Matrix Offshore Wind Turbine Foundation Structure [J]. China Mechanical Engineering, 2023, 34(20): 2428-2433，2474.
[9]	LU Yaoan, QIU Hongjian, WANG Chengyong, . Smooth Tool Orientation Generation Method of Five-axis Ball-end Milling via RTOs Interpolation [J]. China Mechanical Engineering, 2023, 34(20): 2466-2474.
[10]	QU Xiaozhang, ZHANG Jiabei, ZHAI Fangzhi. Sensitivity Analysis and Optimization of High Speed Train Cooling Centrifugal Fan Performance [J]. China Mechanical Engineering, 2023, 34(20): 2504-2512.
[11]	XU Meijiao, XUE Shanliang, ZHANG Hui, ZHOU Guoqing, LU Honggen. Manufacturing Readiness Level Assessment Method of Complex Product Assembly Based on BP-AdaBoost Algorithm [J]. China Mechanical Engineering, 2023, 34(20): 2513-2519.
[12]	XIE Zhong, WEN Donghui, CHENG Zhichao, KONG Fanzhi. Derivation Mechanism of Cyclic Alternating Dynamic Pressures in Linear Hydrodynamic Polishing Flow Fields [J]. China Mechanical Engineering, 2023, 34(19): 2288-2295.
[13]	YANG Jisen, ZHOU Run, ZHANG Tianheng, LU Yu, WU Zhuo, ZHANG Di, ZHANG Jing. Research on Magnetic Field Compensated Double-layer Time-grating Angular Displacement Sensors under Structural Parameter Constraints [J]. China Mechanical Engineering, 2023, 34(19): 2296-2303，2312.
[14]	PU Zhixin, GUO Jianwei, PAN Yuqi, BAI Yangxi. Performance Analysis and Optimization Design of 2PPaPaR Parallel Mechanism [J]. China Mechanical Engineering, 2023, 34(19): 2304-2312.
[15]	YANG Liang, CAI Guixi, LIU Fang, LI Jiankui. Ultrasonic Nondestructive Testing and Evaluation of CFRP Hole-making Structures [J]. China Mechanical Engineering, 2023, 34(19): 2327-2332.