基于焊点形态分析的小节距BGA焊盘尺寸设计

陈轶龙, 贾建援, 付红志, 朱朝飞

Design of Fine Pitch BGA Solder Joint Pad Based on Solder Joint Shape Analyses

Chen Yilong, Jia Jianyuan, Fu Hongzhi, Zhu Zhaofei

中国机械工程 . 2016, (13): 1779 -1782 .