关键词: 球栅阵列封装, 承载力, 焊盘, 节距

Abstract: The influences of solder joint shape on the solder joint height were studied to find the optimal matching relations of the volume, the pitch and the pad of BGA solder joint to increase solder yield. The Young-Laplace equation with the constraint of the volume was solved based on the Runge-Kutta method. The influences of the solder joint volume and diameter of pad on the solder joint height range were simulated. The results show that the whole solder joint height range shifts left or right with the changing solder joint volume. The influences of the pad diameter on the maximum height of the solder joint are of more obvious. The warping adapting to the package might be obtained by changing solder joint volume and pad diameter at the same time.Based on the standard of a 0.4mm pitch of BGA package of ZTE, the optimal matching relations of the solder joint volume and the diameter of the pad were analyzed with the 0.35mm pitch and 0.3mm pitch respectively.

Key words: ball grid array(BGA) package, carrying capacity, pad, pitch