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蒋建忠1, 袁晓林2, 赵永武1

Factors Influencing Indentation Depth of a Particle into Wafer Surface in CMP

JIANG Jian-Zhong-1, YUAN Xiao-Lin-2, DIAO Yong-Wu-1

中国机械工程 . 2011, (15): 1783 -1787 .