关键词: 单晶硅；加工；裂纹；离散元；仿真

Abstract:

Discrete element model of monocrystalline silicon was constructed and calibrated. Based on the model, the dynamic process of micro-machining of silicon was simulated, and the effects of different cutting speeds, cutting depths and rank angles on the formation of surface cracks and debris were also analyzed. Results show that both of the surface crack number and maximum depth increases with increase of the cutting speed and cutting depth, while decreases as the rake angle increases; when the rake angle becomes positive from negative, the damage zone which is under and in front of the tool gradually increases; the damage level of silicon are remained without changes before the rank angle is changed to 0°, but the damage level becomes dramatically heavy when the rake angle reaches to -15°. 

Key words: monocrystalline silicon, machining, crack, discrete element, simulation