Bonding Techniques for Fabrication of Thermoplastic Microfluidic Chips

Abstract

Abstract:

In fabrication of microfluidic chips, bonding of substrate and cover is the procedure for formation of enclosed micro channels, and is one of the key techniques for fabrication of microfluidic chips, directly affects the quality of the fabricated products. Bonding methods and techniques were summarized, and the limitations of fabrication quality, efficiency and suitability for batch production in available bonding methods were analyzed. Finally, recent research on ultrasonic bonding method was introduced, which has high production efficiency and is suitable for batch production.

Key words: thermalplastic microfluidic chip, bonding technique for microfluidic chip, fabrication technique of microfluidic chip, bio-MEMS device

摘要：

在微流控芯片的制作中，键合是关键技术之一，基片与盖片只有通过键合才能形成封闭的微通道，因此键合质量直接影响芯片的制作质量。对键合方法进行了分类，综述了目前已有的芯片键合技术及方法，分析了各种键合方法在制作质量、制作效率以及是否适用于批量化制作等方面的局限性，详细介绍了具有效率高、适合批量化生产等优点的超声波键合技术的研究进展。

关键词: 聚合物微流控芯片, 微流控芯片的键合技术, 微流控芯片的制作工艺, 生化MEMS器件

CLC Number:

TP242

Luo Yi, Wang Xiaodong, Wang Liding. Bonding Techniques for Fabrication of Thermoplastic Microfluidic Chips[J]. China Mechanical Engineering, 2008, 19(24): 3012-3018.

罗怡, 王晓东, 王立鼎, . 聚合物微流控芯片的键合技术与方法[J]. 中国机械工程, 2008, 19(24): 3012-3018.

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Bonding Techniques for Fabrication of Thermoplastic Microfluidic Chips

聚合物微流控芯片的键合技术与方法

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