Study on Ultrasonic-assisted Femtosecond Laser Ablation Mechanism and Process of Silicon Carbide Ceramics

doi:10.3969/j.issn.1004-132X.2026.08.022

Abstract

Abstract:

This study employs a novel ultrasonic-assisted femtosecond laser ablation method based on a focusing lens. By controlling the high-frequency vibration of the focusing lens， dynamic modulation of the energy density is achieved. The effects of laser power and ultrasonic power on the three-dimensional ablation morphology of silicon carbide ceramics are systematically investigated. Experimental results indicate that ultrasonic assistance can periodically alter the spot diameter and energy density distribution， thereby effectively suppressing the plasma shielding effect. At a low laser power （≤5 W）， high ultrasonic power levels （50%‒70%） reduce the energy deposition rate， leading to a decrease in ablation depth. In contrast， at a high laser power （≥13 W）， the ablation depth reaches 129.46 μm under 70% ultrasonic power， representing a 54% increase compared to the condition without ultrasonic assistance. Furthermore， the oxygen content in the heat-affected zone is significantly reduced under ultrasonic assistance. This work provides theoretical and technical support for ultrasonic-assisted femtosecond laser machining and offers new insights into achieving high-efficiency and high-quality laser processing of silicon carbide ceramics.

Key words: silicon carbide ceramics, ultrasonic vibration, laser processing, energy density modulation, laser ablation

摘要：

采用一种超声辅助透镜飞秒激光烧蚀新方法，通过控制聚焦透镜高频振动实现动态能量密度调制，系统探究了激光功率与超声功率对碳化硅陶瓷烧蚀三维形貌的影响。结果表明：超声辅助可周期性改变光斑直径与能量密度分布，有效抑制等离子体屏蔽效应；低激光功率（P≤5 W）时，高超声功率（50%~70%）会降低能量沉积速率，导致烧蚀深度减小；高激光功率（P≥13 W）时，70%超声功率可使烧蚀深度达129.46 μm，较无超声工况提高54%，且热影响区氧元素密度显著降低。

关键词: 碳化硅陶瓷, 超声振动, 激光加工, 能量密度调制, 激光烧蚀

CLC Number:

TN249

LIN Yingliang, CHEN Xiaoxiao, MA Chenbin, LI Qi, ZHANG Wenwu. Study on Ultrasonic-assisted Femtosecond Laser Ablation Mechanism and Process of Silicon Carbide Ceramics[J]. China Mechanical Engineering, 2026, 37(8): 2029-2037.

林颖亮, 陈晓晓, 马晨斌, 李奇, 张文武. 碳化硅陶瓷超声辅助飞秒激光烧蚀机理与工艺研究[J]. 中国机械工程, 2026, 37(8): 2029-2037.

Figures/Tables 13

Fig.1 Schematic diagram of ultrasonic-assisted femtosecond laser machining system

Tab.1 Performance parameters of silicon carbide ceramics

密度/

（g·cm³）

弯曲强度/

MPa

显微硬度/MPa

热膨胀系数/

K $- 1$

热导率/

（W·m $- 1$ ·K $- 1$ ）

- 6

Tab.1 Performance parameters of silicon carbide ceramics

密度/

（g·cm³）

弯曲强度/

MPa

显微硬度/MPa

热膨胀系数/

K $- 1$

热导率/

（W·m $- 1$ ·K $- 1$ ）

3.2

500

2500

4.2×10

- 6

Tab.2 Experimental parameters of ultrasonic-assisted femtosecond laser ablation

参数	值
离焦量Z/mm	0
激光重复频率F/kHz	100
激光功率P/W	3、5、7、9、11、13、15
烧蚀时间t/s	5
超声功率（百分比）P_u/%	0、30、50、70
超声频率F_u/kHz	20

Fig.2 Ablation surface morphology under different combinations of laser power and ultrasonic power

Tab.3 Variables and their physical meanings related to dynamic energy density analysis

变量符号	物理意义	单位
λ	脉冲激光波长	nm
ω₀	激光入射超声透镜前的束腰半径	mm
f₁	超声辅助聚焦透镜焦距	mm
f₂	场镜焦距	mm
A	超声透镜沿光轴振动的振幅	μm
F_u	超声透镜振动频率	kHz
t	时间变量	s
z₀	入射激光束腰到超声透镜的静态固定距离	mm
Δz（t）	超声振动引发的动态位移	μm
ω₁（t）	超声透镜出射光束在静态焦平面处的瞬态光斑半径	μm
ω_surf（t）	加工表面瞬时光斑半径	μm
D（t）	加工表面瞬时光斑直径	μm
z_R0	入射光束瑞利长度	mm

Fig.3 The ablation morphologies under different laser powers

Fig.4 The ablation morphologies and cross-sectional profiles corresponding to different ultrasonic powers （P=15 W）

Fig.5 Effects of different laser powers and ultrasonic powers on ablation depth and diameter

Fig.6 Effects of laser power and ultrasonic power on ablation aspect ratio

Fig.7 Schematic diagrams of conventional and ultrasonic-assisted femtosecond laser ablation mechanisms

Fig.8 Microscopic morphology of machining characteristics under different ultrasonic powers （P=15 W）

Fig.9 EDS elemental distribution of C， O and Si under different ultrasonic power percentages（P=15 W）

Fig.10 Variation of EDS O element content under different ultrasonic power percentages（P=15 W）

References 27

[1]	WILLANDER M， FRIESEL M， WAHAB Q U， et al. Silicon Carbide and Diamond for High Temperature Device Applications［J］. Journal of Materials Science： Materials in Electronics， 2006， 17（1）： 1-25.
[2]	SAMANT A N， DAHOTRE N B. Laser Machining of Structural Ceramics—a Review［J］. Journal of the European Ceramic Society， 2009， 29（6）： 969-993.
[3]	PUSHPAKARAN B N， SUBBURAJ A S， BAYNE S B， et al. Impact of Silicon Carbide Semiconductor Technology in Photovoltaic Energy System［J］. Renewable and Sustainable Energy Reviews， 2016， 55： 971-989.
[4]	BINNER J， PORTER M， BAKER B， et al. Selection， Processing， Properties and Applications of Ultra-high Temperature Ceramic Matrix Composites， UHTCMCs—a Review［J］. International Materials Reviews， 2020， 65（7）： 389-444.
[5]	PADTURE N P. Advanced Structural Ceramics in Aerospace Propulsion［J］. Nature Materials， 2016， 15（8）： 804-809.
[6]	GU Yan， ZHU Wenhui， LIN Jieqiong， et al. Subsurface Damage in Polishing Process of Silicon Carbide Ceramic［J］. Materials， 2018， 11（4）： 506.
[7]	XU Gang， DAI Yutang， CUI Jianlei， et al. Simulation and Experiment of Femtosecond Laser Polishing Quartz Material［J］. Integrated Ferroelectrics， 2017， 181（1）： 60-69.
[8]	MEIJER J. Laser Beam Machining （LBM）， State of the Art and New Opportunities［J］. Journal of Materials Processing Technology， 2004， 149（1/2/3）： 2-17.
[9]	FAN Zhengjie， PEI Zhiming， SHE Zukun， et al. Dual-directional Ultrasonic Vibration-assisted Femtosecond Laser Drilling of Film Cooling Holes［J］. Optics & Laser Technology， 2025， 180： 111484.
[10]	姚喆赫，张群莉，王梁，等. 激光复合制造技术研究进展［J］. 电加工与模具， 2022（1）： 1-13.
	YAO Zhehe， ZHANG Qunli， WANG Liang， et al. State-of-the-art Review on Laser Hybrid Manufacturing Technology［J］. Electromachining & Mould， 2022（1）： 1-13.
[11]	WANG Wenjie， ZOU Ping， XU Jilin， et al. Regulating Mechanisms of Ultrasonic Vibration on the Bulge Formation in Laser Polishing［J］. Surface and Coatings Technology， 2024， 487： 130947.
[12]	姚喆赫，潘成颢，迟一鸣，等. 超声复合激光制造技术研究进展［J］. 中国激光， 2024， 51（4）： 41-59.
	YAO Zhehe， PAN Chenghao， CHI Yiming， et al. Research Progress of Ultrasonic Assisted Laser Manufacturing Technology（Invited）［J］. Chinese Journal of Lasers， 2024， 51（4）： 41-59.
[13]	王以珅，张咪娜，王大锋，等. 超声振动辅助金属熔化成形技术研究进展［J］. 中国激光， 2024， 51（24）： 2402101.
	WANG Yishen， ZHANG Mina， WANG Dafeng， et al. Advances in Ultrasonic Vibration-assisted Metal Melting and Forming Technology［J］. Chinese Journal of Lasers， 2024， 51（24）： 2402101.
[14]	XIA Kaibo， REN Naifei， WANG Houxiao， et al. Analysis for Effects of Ultrasonic Power on Ultrasonic Vibration-assisted Single-pulse Laser Drilling［J］. Optics and Lasers in Engineering， 2018， 110： 279-287.
[15]	ZHENG H Y， HUANG H. Ultrasonic Vibration-assisted Femtosecond Laser Machining of Microholes［J］. Journal of Micromechanics and Microengineering， 2007， 17（8）： N58.
[16]	WANG Houxiao， ZHU Sukai， XU Guoxiang， et al. Influence of Ultrasonic Vibration on Percussion Drilling Performance for Millisecond Pulsed Nd：YAG Laser［J］. Optics & Laser Technology， 2018， 104： 133-139.
[17]	TODARO C J， EASTON M A， QIU D， et al. Grain Refinement of Stainless Steel in Ultrasound-assisted Additive Manufacturing［J］. Additive Manufacturing， 2021， 37： 101632.
[18]	ALAVI S H， HARIMKAR S P. Melt Expulsion during Ultrasonic Vibration-assisted Laser Surface Processing of Austenitic Stainless Steel［J］. Ultrasonics， 2015， 59： 21-30.
[19]	ZHENG Qingzhen， MEI Xuesong， JIANG Gedong， et al. Investigation on Ultrasonic Vibration-assisted Femtosecond Laser Polishing of C/SiC Composites［J］. Journal of the European Ceramic Society， 2023， 43（11）： 4656-4672.
[20]	YANG Zhichao， ZHU Lida， ZHANG Guixiang， et al. Review of Ultrasonic Vibration-assisted Machining in Advanced Materials［J］. International Journal of Machine Tools and Manufacture， 2020， 156： 103594.
[21]	PARK J K， YOON J W， CHO S H. Vibration Assisted Femtosecond Laser Machining on Metal［J］. Optics and Lasers in Engineering， 2012， 50（6）： 833-837.
[22]	KANG Di， ZOU Ping， WU Hao， et al. Research on Ultrasonic Vibration-assisted Laser Polishing of the 304 Stainless Steel［J］. Journal of Manufacturing Processes， 2021， 62： 403-417.
[23]	CHEN Jianbo， CHEN Xiaoxiao， ZHANG Xuanhua， et al. Effect of Laser Incidence Angle on the Femtosecond Laser Ablation Characteristics of Silicon Carbide Ceramics［J］. Optics and Lasers in Engineering， 2024， 172： 107849.
[24]	ZHAI Zhaoyang， ZHANG Yanchao， CUI Yahui， et al. Investigations on the Ablation Behavior of C/SiC under Femtosecond Laser［J］. Optik， 2020， 224： 165719.
[25]	EATON S， ZHANG Haibin， HERMAN P， et al. Heat Accumulation Effects in Femtosecond Laser-written Waveguides with Variable Repetition Rate［J］. Optics Express， 2005， 13（12）： 4708-4716.
[26]	TONG Yonggang， BAI Shuxin， ZHANG Hong， et al. Laser Ablation Behavior and Mechanism of C/SiC Composite［J］. Ceramics International， 2013， 39（6）： 6813-6820.
[27]	ZHAI Zhaoyang， WEI Chen， ZHANG Yanchao， et al. Investigations on the Oxidation Phenomenon of SiC/SiC Fabricated by High Repetition Frequency Femtosecond Laser［J］. Applied Surface Science， 2020， 502： 144131.