关键词: 单颗磨粒, 超声辅助磨削, SiC陶瓷, 磨削划痕形貌, 材料去除机理

Abstract:  To study the effects of ultrasonic vibrations on the material removal mechanism during grinding of SiC ceramics under different grinding speeds， a brazed single abrasive grain tool was used to conduct comparison tests for UAG and conventional grinding（CG）. In addition， the tests were conducted on the polished surfaces based on the continuous variable grinding depth methods. The results show that the materials for both UAG and CG of SiC both experience the following changing stages， i. e.， plastic removal→brittle-plastic transition→large scale brittle fracture， with increasing grinding depths of the single abrasive grain. Compared to CG， UAG may effectively enlarge the critical depth of brittle-plastic transition for SiC ceramics when grinding speed is as 1 m/s， and may also produce lower tangential grinding forces and specific grinding energies. However， the differences between UAG and CG forthe critical depth of brittle-plastic transition and grinding forces will be gradually weakened with increasing grinding speed. 

Key words:  , single abrasive grain, ultrasonic assisted grinding（UAG）, SiC ceramic, grinding scratch morphology, material removal mechanism