固结与游离磨粒协同作用硬脆材料磨抛加工机理

doi:10.3969/j.issn.1004-132X.2025.06.003

中国机械工程 ›› 2025, Vol. 36 ›› Issue (06): 1159-1169，1177.DOI: 10.3969/j.issn.1004-132X.2025.06.003

固结与游离磨粒协同作用硬脆材料磨抛加工机理

罗晨阳^1,2;郭磊^1,2*;曹雏清²;曹蕾蕾³;施鹏飞^1,2

1.长安大学道路施工与技术装备教育部重点实验室，西安，710064
2.芜湖哈特机器人产业技术研究院有限公司，芜湖，241007
3.广西制造系统与先进制造技术重点实验室，桂林，530003

出版日期:2025-06-25 发布日期:2025-08-01
作者简介:罗晨阳，男，1999年生，硕士研究生。研究方向为精密与智能制造技术。E-mail：252653927@qq.com。
基金资助:
国家自然科学基金(51805044)；陕西省自然科学基础研究计划(2022JM-254)；广西制造系统与先进制造技术重点实验室开放基金(22-35-4-S010)

Grinding and Polishing Mechanism of Hard and Brittle Materials under Cooperation of Fixed and Free Abrasive Grains

LUO Chenyang^1,2;GUO Lei^1,2*;CAO Chuqing²;CAO Leilei³;SHI Pengfei^1,2

1.Key Laboratory of Road Construction and Technical Equipment(Ministry of Education),
Changan University,Xian,710064
2.Wuhu HIT Robot Technology Research Institute Co.，Ltd.,Wuhu,Anhui,241007
3.Guangxi Key Lab of Manufacturing System and Advanced Manufacturing Technology,
Guilin,Guangxi,530003

Online:2025-06-25 Published:2025-08-01

摘要/Abstract

摘要： 为了揭示硬脆材料弹性磨抛加工过程中固结与游离磨粒协同作用下的材料去除机理，设计了一种硅胶基体金刚石砂纸磨抛工具，通过配备不同浓度金刚石抛光浆料进行磨抛加工。研究了弹性工具工件间的接触应力场、速度场分布以及磨粒工件间的接触力学，建立了硬脆材料弹性磨抛加工过程中的材料去除模型。以SiC工件为加工对象，以磨抛压力、磨具转速、磨料浓度等工艺参数为影响因素完成单点磨抛加工验证实验，对磨抛加工表面材料去除轮廓进行表征。实验结果表明，建立的材料去除模型与实际材料去除深度的误差范围为4.68%~8.22%，材料去除深度与磨抛压力、磨具转速和磨料浓度成正相关，所建模型能够较好地预测弹性磨抛加工材料去除行为。

关键词: 硬脆材料, 材料去除机理, 弹性磨抛工具, 固结磨粒, 游离磨粒

Abstract: To investigate the material removal mechanism of hard and brittle materials during elastic grinding and polishing involving fixed and free abrasive grains, a diamond sandpaper grinding and polishing tool integrated with silicone rubber matrix was developed. The elastic tool was paired with varying concentrations of diamond polishing slurry. The contact stress and velocity distributions between the elastic tool and workpiece, as well as the abrasive grain-workpiece contact mechanics were analyzed to establish the material removal models for hard and brittle materials. Subsequently, silicon carbide workpieces were used as test samples, with grinding and polishing pressure, tool speed, and abrasive concentration as processing parameters in single-point experiments, which were conducted to characterize the material removal profile on the machined surfaces. The experimental results reveal that the discrepancies between the established material removal models and the actual material removal depth range from 4.68% to 8.22%. The removal depth is positively correlated with grinding and polishing pressure, tool speed, and abrasive concentration. The established models may accurately predict material removal behaviors in elastic grinding and polishing processes.

Key words: hard and brittle material, material removal mechanism, elastic grinding and polishing tool, fixed abrasive grain, free abrasive grain

中图分类号:

TG58

罗晨阳1, 2, 郭磊1, 2, 曹雏清2, 曹蕾蕾3, 施鹏飞1, 2. 固结与游离磨粒协同作用硬脆材料磨抛加工机理[J]. 中国机械工程, 2025, 36(06): 1159-1169，1177.

LUO Chenyang1, 2, GUO Lei1, 2, CAO Chuqing2, CAO Leilei3, SHI Pengfei1, 2. Grinding and Polishing Mechanism of Hard and Brittle Materials under Cooperation of Fixed and Free Abrasive Grains[J]. China Mechanical Engineering, 2025, 36(06): 1159-1169，1177.

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https://www.cmemo.org.cn/CN/Y2025/V36/I06/1159

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固结与游离磨粒协同作用硬脆材料磨抛加工机理

Grinding and Polishing Mechanism of Hard and Brittle Materials under Cooperation of Fixed and Free Abrasive Grains

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