Modeling and Control of Jetting Dispensing Processes in Microelectronics Packaging

Abstract

Abstract: To solve the problems of consistency of jetting dispensing systems, a Run by Run PI control method was proposed, which was based on the drop volume estimation model. The rheological behavior of fluid was analyzed. Based on the empirical equation between shear stress and shear rate, the flow rate of jetting dispensing processes was established to derive the volume estimation model. To achieve the consistency control in jetting dispensing systems, the Run by Run PI controller was designed based on the volume estimation model. The simulation and experimental results verify the reliability of the model and demonstrate that the proposed control method may improve the consistency of jetting dispensing systems effectively.

Key words: jetting dispensing, rheological behavior, volume estimation model, consistency

摘要： 针对喷射点胶阀存在点胶一致性差的问题，提出了一种基于体积估计模型的批次PI控制策略。通过对胶体流变特性进行分析，基于胶体剪切应力和剪切速率关系建立了喷射点胶的流量模型，依此推导出体积估计模型。基于建立的模型，运用批次PI算法来实现喷射点胶阀的一致性控制。仿真和实验结果验证了体积估计模型的可靠性，并表明该控制方法能有效地改善喷射点胶的一致性。

关键词: 喷射点胶, 流变特性, 体积估计模型, 一致性

CLC Number:

TP273

TAN Fang, SHAN Xiuyang. Modeling and Control of Jetting Dispensing Processes in Microelectronics Packaging[J]. China Mechanical Engineering.

谭芳, 单修洋. 微电子封装中的喷射点胶过程建模和控制[J]. 中国机械工程.

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