LI Biao, LI Jun, GAO Beng, SHU Yong-Wei, LUO Hai-Jun, ZUO Dui-Wen. Study on Depth of Subsurface Crack Layer by Free and Fixed Abrasive Lapping[J]. China Mechanical Engineering, 2013, 24(07): 895-898,905.
[1]Suratwala T，Steele R，Feit M D，et al. Effect of Rogue Particles on the Sub-surface Damage of Fused Silica during Grinding/Polishing[J]. Journal of Non-crystalline Solids，2008，354(18)：2023-2037.
[2]张银霞. 单晶硅片超精密加工表面亚表面损伤检测技术[J]. 电子质量，2004(7)：73-75.
Zhang Yinxia.Measurement of Silicon Wafer Surface/Subsurface Damage Induced by Ultra-precision Processing[J]. Electronics Quality，2004(7)：73-75.
[3]李圣怡，王卓，吴宇列，等. 基于研磨加工参数的亚表面损伤预测理论和试验研究[J]. 机械工程学报，2009，45(2)：192-198.
Li Shengyi，Wang Zhuo，Wu Yulie，et al. Prediction Theory and Experiment of Subsurface Damage Based on Lapping Processing Parameters[J]. Journal of Mechanical Engineering，2009，45(2)：192-198.
[4]王卓，吴宇列，戴一帆，等. 光学材料研磨亚表面损伤的快速检测及其影响规律[J]. 光学精密工程，2006,16(1)：16-21.
Wang Zhuo，Wu Yulie，Dai Yifan，et al. Rapid Detection of Subsurface Damage of Optical Materials in Lapping Process and Its Influence Regularity[J]. Optics and Precision Engineering，2006，16(1)：16-21.
[5]李改灵，吴宇列，王卓，等. 光学材料亚表面损伤深度破坏性测量技术的实验研究[J]. 航空精密制造技术，2006，42(6)：19-22．
Li Gailing，Wu Yulie，Wang Zhuo，et al. Experiment Study on the Destructive Measurement of the Depth of SSD for Optical Material[J]. Aviation Precision Manufacturing Technology，2006，42(6)：19-22．
[6]吴东江，曹先锁，王强国，等. KDP晶体加工表面的亚表面损伤检测与分析[J]. 光学精密工程，2007，15(11)：1721-1726．
Wu Dongjiang，Cao Xiansuo，Wang Qiangguo，et al. Damage Detection and Analysis of Machined KDP Crystal Subsurface[J].Optics and Precision Engineering，2007，15(11)：1721-1726．
[7]王强国，高航，裴志坚，等. KDP晶体超声辅助磨削的亚表面损伤研究[J]. 人工晶体学报，2010，39(1)：67-71.
Wang Qiangguo，Gao Hang，Pei Zhijian，et al. Study on the Subsurface Damage of KDP Crystal Ground with Ultrasonic Vibration Assistance[J]. Journal of Synthetic Crystals，2010，39(1)：67-71.
[8]马彬，沈正祥，张众，等. 低亚表面损伤石英光学基底的加工和检测技术[J]. 强激光与粒子束，2010，22(9)：2181-2185.
Ma Bin，Shen Zhengxiang，Zhang Zhong，et al. Fabrication and Detection Technique of Fused Silica Substrate with Extremely Low Subsurface Damage[J]. High Power Laser and Particle Beams，2010，39(1)：67-71.
[9]Suratwala T，Wong L，Miller P，et al. Sub-surface Mechanical Damage Distributions during Grinding of Fused Silica[J]. Journal of Non-crystalline Solids，2006，352(52/54)：5601-5617．
[10]Gao P，Li J，Zhu Y W，et al. Study on Subsurface Damage after Fixed-abrasive Lapping with Different Particle Size[J]. Solid State Phenomena，2011，175：112-115．
[11]Li J，Gao P，Zhu Y W，et al. Research on Subsurface Damage after Abrasives and Fixed-abrasive Lapping of K9 Glass[J]. Key Engineering Materials，2011,487: 253-256.
[12]Li J，Zhu Y W，Zuo D W，et al. Fixed Abrasive Lapping and Polishing of Hard Brittle Materials[J]. Key Engineering Materials，2010，426/427：589-592.
[13]朱永伟，王军，李军. 固结磨料抛光垫抛光硅片的探索研究[J]. 中国机械工程，2009，20(6)：723-727.
Zhu Yongwei，Wang Jun，Li Jun. Exploratory Study of Lapping Silicon Wafer with Fixed Abrasive Pad[J]. China Mechanical Engineering，2009，20(6)：723-727.
[14]林奎，朱永伟，李军，等. 固结磨料抛光K9光学玻璃的工艺实验研究[J]. 激光与光电子学进展，2010，47(4)：041603.
Lin Kui，Zhu Yongwei，Li Jun，et al. Experimental Study on Polishing Technology of K9 Optical Glass with Fixed Abrasive Pad[J]. Laser and Optoelectronics Progress，2010，47(4)：041603.
