In order to improve the uniformity of the contact pressure distribution of chemical mechanical polishing, based on the theory of Winkler foundation and phyllotaxis theory, a kind of stannum pad with bionic surface texture was designed, and the contact mechanism and ANSYS models were established. By the calculation of contact pressure distribution on polishing wafer, the contact pressure distribution

between the wafer and the pad, the effects of the geometrical and physical parameters on the contact pressure distributions were obtained. The results show that the horizontal effect of the polishing pad is very small, the uniformity of contact pressure distribution can be improved, and there are the phyllotactic parameters which make the contact pressure distribution more uniformity. 

为了让化学机械抛光中晶片接触表面受力更均匀，基于Winkler地基理论及叶序理论设计了一种锡仿生结构抛光垫，并且建立了抛光的接触力学模型和有限元分析模型。通过对抛光晶片表面接触压力的计算，获得了晶片表面接触压力分布，以及各物理参数对压力分布的影响规律。研究结果表明，使用锡仿生结构抛光垫能减小材料横向牵连效应，改善接触压力分布，而且存在使压力分布更为均匀的叶序参数。

化学机械抛光, Winkler地基, 叶序, 晶片, 表面形貌