CLC Number:
DING Yong, KONG Shu-Qing, JIN Zhang-Jiao, ZHENG Rong-Ti.
Molecular Dynamic Simulation on Mechanism of Ultrasonic Wire Bonding in Electronic Package
[J]. China Mechanical Engineering, 2010, 21(20): 2496-2500.
丁勇, 孔树清, 金章教, 郑荣跃.
电子封装中超声波线焊机理的分子动力学模拟研究
[J]. 中国机械工程, 2010, 21(20): 2496-2500.