超声振动辅助固结磨粒抛光硅片表面形成机理及实验
曾一凡, 杨卫平, 吴勇波, 刘曼利
Mechanism of Surface Formation of Silicon Wafer Processed by Fixed Abrasive Polishing with Assistance of Ultrasonic Vibration and Experiments
Zeng Yifan, Yang Weiping, Wu Yongbo, Liu Manli
中国机械工程
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2016, (23): 3208
-3214
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