纳米ZrO2牙科陶瓷磨削材料去除机理的实验研究

中国机械工程 ›› 2013, Vol. 24 ›› Issue (09): 1150-1154.

纳米ZrO2牙科陶瓷磨削材料去除机理的实验研究

韩振鲁1;李长河1;王胜1;毛伟平2

1.青岛理工大学，青岛，266033
2.亿隆自动化不锈钢技术（青岛）有限公司，青岛，266108

出版日期:2013-05-10 发布日期:2013-05-16
基金资助:
国家自然科学基金资助项目(50875138，51175276)；山东省自然科学基金资助重点项目(Z2008F11)
National Natural Science Foundation of China（No. 50875138，51175276）;
Shandong Provincial Natural Science Foundation of China（No. Z2008F11）

Experimental Investigation into Material Removal Mechanism of Nano-ZrO2 Dental Ceramic Grinding

Han Zhenlu1;Li Changhe1;Wang Sheng1;Mao Weiping2

1.Qingdao Technological University,Qingdao，Shandong,266033
2.Elo Automated Stainless Steel Qingdao Co.,Ltd.，Qingdao，Shandong,266108

Online:2013-05-10 Published:2013-05-16
Supported by:

National Natural Science Foundation of China（No. 50875138，51175276）;
Shandong Provincial Natural Science Foundation of China（No. Z2008F11）

摘要/Abstract

摘要：

对纳米ZrO2牙科陶瓷磨削中脆性和塑性去除转变的材料去除机理进行了理论分析与实验研究。利用K-P36精密数控平面磨床对3Y-TZP纳米ZrO2牙科陶瓷进行磨削加工实验。用YDM-III99型整体式三向压电磨削测力仪测量三向磨削力，用TALSURF5轮廓仪测量加工后的微观几何参数值，用扫描电镜观察表面微观形貌变化。实验结果表明，未变形磨屑的最大厚度小于1.9μm时为塑性去除方式;未变形磨屑的最大厚度为1.9～2.1μm时开始出现由侧向裂纹引起的脆性断裂去除，为塑性和脆性混合去除方式;未变形磨屑的最大厚度为5.23μm时，加工表面发生了大规模的脆性断裂，并且表面还残留了大量的半硬币形脆性断裂产生的凹坑，为脆性去除方式。

关键词: 纳米ZrO2, 牙科陶瓷, 磨削, 材料去除机理

Abstract:

Aiming at the theoretical analysis and experimental investigation on the critical conditions for the brittle-ductile removal mechanism in nano-ZrO2 dental ceramic grinding,a K-P36 numerical-control precision surface grinder was employed for the grinding test on 3Y-TZP nano-ZrO2 dental ceramics. The YDM-III99 integral three-dimensional piezoelectric grinding dynamometer was employed to measure three-dimensional grinding forces. The TALSURF5 contourgraph was used to measure the micro-geometrical parameters after the grinding, and a SEM was used to observe the variation in the surface micromorphology. The experimental results indicate that the maximal thickness of the undeformed chip thickness smaller than 1.9μm corresponds to the ductile removal mode. The brittle-fracture removal induced by side cracks appears when the maximal thickness of undeformed chip thickness is between 1.9 and 2.1μm, and the removal mode is brittle-ductile mixed removal. When the maximal thickness of undeformed chip thickness is as 5.23μm, large-scale brittle fracture appears at the grinding surface, and a large number of pits induced by the brittle fracture in half-coin shape remaines on the surface.

Key words: nano-ZrO2, dental ceramic, grinding, material removal mechanism

中图分类号:

TG580

韩振鲁1, 李长河1, 王胜1, 毛伟平2. 纳米ZrO2牙科陶瓷磨削材料去除机理的实验研究[J]. 中国机械工程, 2013, 24(09): 1150-1154.

HAN Zhen-Lu-1, LI Chang-He-1, WANG Qing-1, MAO Wei-Beng-2. Experimental Investigation into Material Removal Mechanism of Nano-ZrO2 Dental Ceramic Grinding[J]. China Mechanical Engineering, 2013, 24(09): 1150-1154.

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