[1]Kao I,Prasad M,Li J,et al.Wafer Slicing and Wire Saw Manufacturing Technology[C]//NSF Grantees Conference.Seattle,1997:239-240.
[2]Kao I,Bhagavat M,Prasad V,et al.Integrated Modeling of Wire Saw in Wafer Slicing[C]//NSF Design and Manufacturing Grantees Conference.Monterrey,1998:425-426.
[3]Li J,Kao I,Prasad V.Modeling Stresses of Contacts in Wire Saw Slicing of Poly-Crystalline and CrystallineIngots:Application to Silicon Wafer Production[J].Journal of Electron Packaging,1998,120(2):123-128.
[4]Mller H J.Basic Mechanisms and Model of Multi Wire Sawing[J].Advanced Engineering Materials,2004,6(7):501-513.
[5]Mller H J,Funke C,Rinio M,et al.Multicrystalline Silicon for Solar Cells[J].Thin Solid Films,2005,487:179-187.
[6]Yang F Q,Kao I.Free Abrasive Machining in Slicing Brittle Materials with Wiresaw[J].Journal of Electronic Packaging,2001,123(3):254-259.
[7]Bhagavat M,Prasad V,Kao I.Elasto-hydrodynamic Interaction in the Free Abrasive Wafer Slicing Using a Wire Saw:Modeling and Finite Element Analysis[J].Journal of Tribology,2000,122(4):394-404.
[8]葛培琪,桑波.游离磨粒线锯切片流体动压效应的数值分析[J].润滑与密封,2007(2):16-18.
Ge Peiqi,Sang Bo.Numerical Analysis of Hydrodynamic Action in Free Abrasive Wire Saw Slicing Process[J].Lubrication Engineering,2007(2):16-18.
[9]桑波.单晶硅线锯切片过程中的流体动压效应[D].济南:山东大学,2006.[10]
Yao C Y,Peng W,Wang M H,et al.The Diamond Wire Saw with a Nonmetallic Core[J].Advanced Material Research,2009,69/70:328-332.
[11]Liu F Q,Yao C Y,Peng W.Key Factors in Ultraviolet-curing Wire Saw[C]//
Proceedings of the International Conference on Integration and Commercialization of Micro and Nanosystems.Texas,2007:1283-1288.
[12]刘福庆.紫外光固化金刚石线锯制造技术研究[D].杭州:浙江工业大学,2009.
[13]Bidiville A,Wasmer K,Kraft R,et al.Diamond Wire-sawn Silicon Wafers-from the Lab to the Cell Production[C]//Proceedings of the 24th EU PV-SEC.Hamburg,2009:1400-1405. |