纳米多晶铜单点金刚石切削亚表层损伤机理

摘要/Abstract

摘要： 基于Poisson-Voronoi和Monte Carlo方法构建了多晶铜分子动力学模型，研究了纳米切削中多晶铜材料去除、切削力变化及晶界与位错间的相互转化机制。研究结果表明：晶界的阻碍作用使得切屑流向发生了改变，并在已加工表面形成凹槽和毛刺；切削过程中晶界前方材料变形能的逐渐积聚及晶界的最终断裂，造成了切削力发生由最大峰值到最小谷值的大幅波动；晶界附近的材料去除经历了材料变形积聚、位错穿越晶界、晶界转变为位错及晶界最终断裂等过程。通过详细分析多晶铜纳米切削中位错与晶界间的演化过程，揭示了晶界与位错间的相互转化机制，丰富了多晶铜亚表层损伤机理的内涵。

关键词: 多晶铜, 纳米切削, 晶界, 亚表层损伤, 位错缺陷演化

Abstract: Based on the Poisson-Voronoi and Monte Carlo methods, the nano polycrystalline copper molecular dynamics model of polycrystalline coppers was constructed. The material removal, change of cutting forces and the reciprocal transformation mechanism between grain boundary and dislocation were studied in nano-cutting. The research results show that the chip flow direction is changed under the hinder actions of grain boundary, and the burrs and cutting grooves are formed on the machined surface. There are several large fluctuations from maximum peak to minimum trough in the vibrational curves of cutting forces, which are caused by deformation energy accumulation and grain boundary fracture. The material removal process near grain boundary is undergone deformation accumulation, dislocation crossing the grain boundary, grain boundary transition into dislocation and grain boundary fracture. By analyzing the evolution processes between grain boundary and dislocation defect in detail, the mechanism of “grain-boundary-dislocation” reciprocal transformation in polycrystalline coppers is drawn out, which enriches the connotation of subsurface damage mechanism of polycrystalline coppers.

Key words: polycrystalline copper, nano-cutting, grain boundary, subsurface damage, dislocation defect evolution

中图分类号:

TP391.9

王全龙1;张超锋1;武美萍1,2;陈家轩3. 纳米多晶铜单点金刚石切削亚表层损伤机理[J]. 中国机械工程.

WANG Quanlong1;ZHANG Chaofeng1;WU Meiping1，2;CHEN Jiaxuan3. Subsurface Damage Mechanism of Nano Polycrystalline Coppers in Single Point Diamond Turning[J]. China Mechanical Engineering.

参考文献

[1]HE Y, YAN, Y, GENG, Y, et al. Fabrication of None-ridge Nanogrooves with Large-radius Probe on PMMA Thin-film Using AFM Tip-based Dynamic Plowing Lithography Approach[J]. Journal of Manufacturing Processes, 2017, 29:204-210.
[2]FANG F , LIU B , XU Z . Nanometric Cutting in a Scanning Electron Microscope[J]. Precision Engineering, 2015, 41:145-152.
[3]HIRATA A, CHEN M. Geometric Frustration of Icosahedron in Metallic Glasses[J]. Science, 2013, 341(6144）：376-379.
[4]PISANO F, PISANELLO, MARCO, et al. Focused Ion Beam Nanomachining of Tapered Optical Fibers for Patterned Light Delivery[J]. Microelectronic Engineering, 2018, 195:41-49.
[5]XU L, ZHANG S, SUN W. Residual Stress Distribution in a Ti-6Al-4V T-joint Weld Measured Using Synchrotron X-ray Diffraction[J]. Journal of Strain Analysis for Engineering Design, 2015, 50(7):445-454.
[6]王全龙. 晶体铜纳米切削加工亚表层晶体结构及缺陷演变机理研究[D]. 哈尔滨：哈尔滨工业大学, 2016.
WANG Quanlong. Research on the Evolution Mechanism of Subsurface Defect and Crystal Structure of Crystal Copper in Nanometric Cutting Process[D]. Harbin: Harbin Institute of Technology, 2016.
[7]YAMAKOV V, WOLF D, PHILLPOT S, et al. Deformation-mechanism Map for Nanocrystalline Metals by Molecular-dynamics Simulation[J]. Nature Materials, 2004, 3(1):43-47.
[8]CHEN M, MA E, HEMKER K, et al. Deformation Twinning in Nanocrystalline Aluminum[J]. Science, 2003, 300(5623):1275-1277.
[9]JANG D, LI X, GAO H, et al. Deformation Mechanisms in Nanotwinned Metal Nanopillars[J]. Nature Nanotechnology, 2012, 7(9):594-601.
[10]KIM S W, LI X, GAO H, et al. In Situ Observations of Crack Arrest and Bridging by Nanoscale Twins in Copper Thin Films[J]. Acta Materialia, 2012, 60(6/7):2959-2972.
[11]WU M, LI J, LUDWIG A, et al. Modeling Diffusion-governed Solidification of Ternary Alloys， Part 1: Coupling Solidification Kinetics with Thermodynamics[J]. Computational Materials Science, 2013, 79:830-840.
[12]LI X, WEI Y, LU L, et al. Dislocation Nucleation Governed Softening and Maximum Strength in Nano-twinned Metals[J]. Nature, 2010, 464(7290):877-880.
[13]MOITRA A. Grain Size Effect on Microstructural Properties of 3D Nanocrystalline Magnesium under Tensile Deformation[J]. Computational Materials Science, 2013, 79:247-251.
[14]YOU Z, LI X, GUI L, et al. Plastic Anisotropy and Associated Deformation Mechanisms in Nanotwinned Metals[J]. Acta Materialia, 2013, 61(1):217-227.
[15]田霞, 崔俊芝, 关晓飞. 单晶铜纳米线弯曲、扭转的变形机制的分子动力学研究[J]. 中国科学:物理学力学天文学, 2012, 42(9):965-972.
TIAN Xia, CUI Junzhi, GUAN Xiaofei. Atomistic Simulations on the Mechanical Behavior of Single-crystalline Cu Nanowires under Bending and Torsion Loads[J]. Scientia Sinica： Physica，Mechanica & Astronomica, 2012, 42(9):965-972.
[16]袁林, 敬鹏, 刘艳华,等. 多晶银纳米线拉伸变形的分子动力学模拟研究[J]. 物理学报, 2014, 63(1):268-273.
YUAN Lin, JING Peng, LIU Yanhua. Molecular Dynamics Simulation of Polycrystal Silver Nanowires under Tensile Deformation[J]. Acta Physica Sinica. 2014, 63(1):268-273.
[17]赵鹏越, 郭永博, 白清顺, 等. 压痕位置对多晶铜纳米压痕变形机理的影响[J]. 哈尔滨工业大学学报, 2018, 50(7):11-16.
ZHAO Pengyue, GUO Yongbo, BAI Qingshun, et al. Influence of Indentation Position on the Nanoindentation Deformation Mechanism of Polycrystalline Copper[J]. Journal of Harbin Institute of Technology, 2018, 50(7):11-16.
[18]宋海洋, 李玉龙. 堆垛层错和温度对纳米多晶镁变形机理的影响[J]. 物理学报, 2012, 61(22):333-338.
SONG Haiyang, LI Yulong. The Effects of Stacking Fault and Temperature on Deformation Mechanism of Nano Crystalline Mg[J]. Acta Physica Sinica, 2012, 61(22):333-338.
[19]王全龙, 张超锋, 武美萍, 等. 单晶铜纳米压印亚表层晶体结构演变机理[J]. 中国机械工程, 2019，30(16):1959-1966.
WANG Quanlong, ZHANG Chaofeng, WU Meiping, et al. Subsurface Crystal Structural Evolution Mechanism of Single Crystal Copper during Nano-indentation [J]. China Mechanical Engineering,2019，30(16):1959-1966.
[20]郭永博. 晶体材料纳米切削加工机理的研究[J]. 哈尔滨：哈尔滨工业大学，2001.
GUO Yongbo. Research on the Mechanism of Nanometer Crystal Material Cutting[J]. Harbin: Harbin Institute of Technology, 2011.
[21]闻鹏, 陶钢, 任保祥,等. 纳米多晶铜的超塑性变形机理的分子动力学探讨[J]. 物理学报, 2015, 64(12):331-338.
WEN Peng, TAO Gang, REN Baoxiang, et al. Superplastic Deformation Mechanism of Nano Crystalline Copper：a Molecular Dynamics study[J]. Acta Physica Sinica, 2015, 64(12):331-338.
[22]张俊杰. 基于分子动力学的晶体铜纳米机械加工表层形成机理研究[D]. 哈尔滨：哈尔滨工业大学, 2011.
ZHANG Junjie. Molecular Dynamics Study of Generation Mechanism of Surface Layer in Nanomechanical Machining of Crystalline Copper[D]. Harbin: Harbin Institute of Technology, 2011.
[23]赵鹏越, 郭永博, 张兴群, 等. 晶粒度对多晶铜纳米压痕表面变形机理影响[J]. 哈尔滨工业大学学报, 2019, 51(7):9-17.
ZHAO Pengyue, GUO Yongbo, ZHANG Xingqun, et al. Influence of Grain Size on the Nanoindentation Deformation Mechanism of Polycrystalline Copper[J]. Journal of Harbin Institute of Technology, 2019, 51(7):9-17.
[24]GUO Y, XU T, LI M. Generalized Type Ⅲ Internal Stress from Interfaces, Triple Junctions and other Microstructural Components in Nanocrystalline Materials[J]. Acta Materialia, 2013, 61(13):4974-4983.
[25]GUO Y, XU T, LI M. Hierarchical Dislocation Nucleation Controlled by Internal Stress in Nanocrystalline Copper[J]. Applied Physics Letters, 2013, 102(24): 241910.
[26]TERSOFF J. Modeling Solid-state Chemistry: Interatomic Potentials for Multicomponent Systems[J]. Physical Review B, 1989, 39:5566-5568.
[27]SATOH A. Stability of Various Molecular Dynamics Algorithms[J]. Journal of Fluid Engineering, 1997,119:476-480.
[28]DAW M, BASKE M. Embedded-atom-method: Derivation and Application to Impurities, Surfaces, and other Defects in Metals[J].Physical Review B,1984, 29(12):6443-6453.
[29]KELCHNER C, PLIMPTON S, HAMITON J. Dislocation Nucleation and Defect Structure during Surface Indentation[J]. Physical Review B, 1998, 58(17):11085-11088.
[30]RINTOUL M, TORQUATO S. Computer Simulations of Dense Hard-sphere Systems[J]. Journal of Chemical Physics, 1996, 105(20):9258-9265.
[31]BECKMANN N, ROMERO P, LINSLER D, et al. Origins of Folding Instabilities on Polycrystalline Metal Surfaces[J]. Physical Review Applied, 2014,2(6): 064004.