温压模具感应加热温度场的有限元模拟分析

中国机械工程 ›› 2011, Vol. 22 ›› Issue (5): 611-615.

温压模具感应加热温度场的有限元模拟分析

尹延国;俞建卫;王永国;解挺;田明;宋平

合肥工业大学,合肥,230009

出版日期:2011-03-10 发布日期:2011-03-24
基金资助:
国家自然科学基金资助项目(50975072，51075114)
National Natural Science Foundation of China（No. 50975072，51075114）

Simulation Analysis of Temperature Field in Induction-heating Warm Compaction Mold by Finite Element Method

Yin Yanguo;Yu Jianwei;Wang Yongguo;Xie Ting;Tian Ming;Song Ping

Hefei University of Technology, Hefei, 230009

Online:2011-03-10 Published:2011-03-24
Supported by:
National Natural Science Foundation of China（No. 50975072，51075114）

摘要/Abstract

摘要：

基于感应加热理论建立了温压模具的感应加热模型,利用ANSYS软件中的电磁-热耦合模块对模具的加热过程进行了温度场的有限元模拟分析,结果表明模具内壁温度沿纵向分布基本均匀一致,内外壁温差较小。模拟结果和试验结果基本吻合,说明采用感应加热方法使得模具的整体温度均匀性好,并易于控制。通过实际感应加热温压成形试验,进一步证实了温压感应加热系统的优越性。



关键词:

温压, 感应加热, 集肤效应, 电磁-热耦合, 温度场模拟

Abstract:

An induction heating model was built for warm compaction mold based on the induction heating theory. The temperature field in the warm compaction mold was analyzed by using electromagnetic-thermal coupling field of ANSYS software. The results show that the longitudinal temperature distribution along the inner wall of the mold is uniform and the temperature difference between the outer wall and inner wall of the mold is very small. The simulation results are in good agreement with the experimental results, which indicates that the temperature distribution in mold is very uniform by using the induction heating method and it is easy to control. The practical test proves that the advantages of induction heating method are very obvious.

Key words:

warm compaction, induction heating, skin effect, electromagnetic-thermal coupling, temperature field simulation

中图分类号:

TF301

尹延国, 俞建卫, 王永国, 解挺, 田明, 宋平.

温压模具感应加热温度场的有限元模拟分析

[J]. 中国机械工程, 2011, 22(5): 611-615.

YIN Yan-Guo, SHU Jian-Wei, WANG Yong-Guo, JIE Ting, TIAN Meng, SONG Beng.

Simulation Analysis of Temperature Field in Induction-heating Warm Compaction Mold by Finite Element Method

[J]. China Mechanical Engineering, 2011, 22(5): 611-615.

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