中国机械工程 ›› 2022, Vol. 33 ›› Issue (01): 2-14,23.DOI: 10.3969/j.issn.1004-132X.2022.01.001

• 机械基础工程 • 上一篇    下一篇

微纳系统微区感应加热技术的研究进展

吴德志1;陈卓1;海振银1;陈亮2;叶坤2;王凌云1;赵立波3   

  1. 1.厦门大学机电工程系,厦门,361005
    2.航空工业自控所惯性技术航空科技重点实验室,西安,710065
    3.西安交通大学机械工程学院,西安,710049
  • 出版日期:2022-01-10 发布日期:2022-01-14
  • 通讯作者: 赵立波(通信作者),男,1978年生,教授、博士研究生导师。研究方向为微纳制造与先进传感技术。获得国家技术发明二等奖2项、国家科技进步二等奖1项。出版专著2部,发表论文200余篇。E-mail:libozhao@xjtu.edu.cn。
  • 作者简介:吴德志,男,1977年生,教授、博士研究生导师。研究方向为微纳制造与装备、柔性智能感知技术和软体机器人。发表论文80余篇。E-mail:wdz@xmu.edu.cn。
  • 基金资助:
    国家自然科学基金(52075464,91648114);
    航空科学基金(20180868002)

Research Progresses of Micro-area Induction Heating Technology in Micro/Nano Systems

WU Dezhi1;CHEN Zhuo1;HAI Zhenyin1;CHEN Liang2;YE Kun2;WANG Lingyun1;ZHAO Libo3   

  1. 1.Department of Mechanical and Electrical Engineering,Xiamen University,Xiamen,Fujian,361005
    2.Aviation Key Laboratory of Science and Technology on Inertial Technology,FACRI,Xi'an,710065
    3.School of Mechanical Engineering,Xi'an Jiaotong University,Xi'an,710049
  • Online:2022-01-10 Published:2022-01-14

摘要: 微区感应加热作为一种局部加热技术,兼具热响应快、非接触及加热特性可控等优势,在微机电系统、微流控芯片等微纳系统领域的应用潜力巨大。介绍了微区感应加热的基本原理,系统阐述了微区感应加热在封装、驱动及材料生长等方向的研究进展,分析了待解决的关键问题,总结并指出了发展方向。

关键词: 感应加热, 局部加热, 微系统, 封装

Abstract: Micro-area induction heating(MIH), as a localized heating technique with characteristics of non-contact, controllable, and fast thermal-response, was shown numerous potentials in microsystems, such as microelectromechanical systems and microfluidic chips. The fundamentals of MIH were introduced herein, and the research progresses of MIH in the fields of packaging, driving, material growth, et al, was presented systematically. Furthermore, some existing technique problems needed to be solved were analyzed, and several prospective research directions of MIH were pointed out.

Key words: induction heating, localized heating, microsystem, packaging

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