Mechanism Analysis of Material Remove and Subsurface Layer Damages for SiC during Nanocutting Processes
Jingjing CHEN, Sha CHEN, Haiyan ZHU, Junjun YUAN, Zeyu LUO
China Mechanical Engineering . 2025, (10): 2312 -2321 .  DOI: 10.3969/j.issn.1004-132X.2025.10.019

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