DIA Method for Multi-part Stacked Structure Devices Based on Disassembly Information Extraction
WANG Yunfan1, 2, ZHU Libin1, 2, CUI Chuangchuang1, 2, HUANG Haihong1, 2
China Mechanical Engineering . 2025, (06): 1269 -1279 .  DOI: 10.3969/j.issn.1004-132X.2025.06.014

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