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ISSN 1004-132X
CN 42-1294/TH
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中文
Influences of Parameters on Multi-Size Tin Solder Bump Array Printed by Uniform Micro Droplets
GAO Kun, LI Yingxiang, QI Lehua, WU Lang, ZHOU Yi, DOU Yibo, LUO Jun
China Mechanical Engineering . 2021, (
19
): 2367 -2373 . DOI: 10.3969/j.issn.1004-132X.2021.19.012
