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ISSN 1004-132X
CN 42-1294/TH
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中文
Analyses of Processing Parameters of BGA Solder Joint Based on Yield of Self-assembly
Chen Yilong, Jia Jianyuan, Fu Hongzhi, Zhu Zhaofei
China Mechanical Engineering . 2016, (
19
): 2658 -2662 .
