×
模态框（Modal）标题
在这里添加一些文本
Close
Close
Submit
Cancel
Confirm
×
模态框（Modal）标题
×
ISSN 1004-132X
CN 42-1294/TH
Home
About
About Journal
Honor
Leading Care
Journal Development Meeting
Editorial Board
Board of Directors
Information
Authors Center
Editorial Center
Journal Online
Current Issue
Archive
Most Read Articles
Most Download Articles
Most Cited Articles
E-mail Alert
RSS
Contacts
Contact Us
Subscribe
E-Journal Subscription
中文
Factors Influencing Indentation Depth of a Particle into Wafer Surface in CMP
JIANG Jian-Zhong-1, YUAN Xiao-Lin-2, DIAO Yong-Wu-1
China Mechanical Engineering . 2011, (
15
): 1783 -1787 .
