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ISSN 1004-132X
CN 42-1294/TH
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中文
Molecular Dynamic Simulation on Mechanism of Ultrasonic Wire Bonding in Electronic Package
DING Yong, KONG Shu-Qing, JIN Zhang-Jiao, ZHENG Rong-Ti
China Mechanical Engineering . 2010, (
20
): 2496 -2500 .
