关键词: 废旧塑封芯片, 分层损伤, 裂纹扩展, 断裂失效

Abstract:

This paper briefly analyzed the delaminated mechanism of waste plastic chips,got the facture energy release rate of chip layered interface crack through calculation, and established the judging criteria of interface crack propagation. Through simulation analysis, the influence rules among the chip internal stress load, crack length and fracture energy release rate required for crack propagation were obtained respectively. The results show that, the internal stress and structure's defects of the waste plastic chips can lead to delamination crack's generation and expansion. Finally, based on the results of theoretical and simulation calculations, this paper analyzed the old chip recycling and reuse technology, and proposed technical method to reduce the scathing of chip delamination.

Key words: waste plastic chip, delamination, crack propagation, fracture failure