Abstract: At present, the CMG technology was widely applied in fields of optics and semiconductors manufacturing, because it might achieve ultra-precision, high quality and low damage processing for hard-brittle materials such as monocrystalline silicon and quartz glass through chemo-mechanical synergistic processes. Current CMG research status around material removal mechanism, grinding processes and compound processes was reviewed, and these existing problems for related researches were summarized. Factors affecting the quality and processing efficiency of CMG were discussed furtherly. The analyses show that revealing the mechanism of CMG from the perspective of solid-solid phase chemical reaction and chemo-mechanical synergistic effect is helpful to innovate feasible methods to improve the processing efficiency of this technology from the perspectives of material removal mechanism, grinding tool structure design and compound processing development. Furthermore, the probable development trend of CMG technology in the direction of diversified processing materials, more complicated structure processing, multi-energy field compound processing, and related intelligent machining databases were forecasted. 

Key words: chemo-mechanical grinding(CMG), hard-brittle material, grinding mechanism, special grinding tool

摘要： 化学机械磨削能通过化学机械协同过程实现单晶硅、石英玻璃等硬脆材料的超精密高质低损加工，被广泛应用于半导体以及光学等领域器件的平坦化加工。在综述化学机械磨削技术材料去除机理、磨削工艺以及复合加工工艺等方面研究现状的基础上，对上述研究现阶段存在的问题进行了分析讨论。分析表明，从固固相化学反应机制和化学机械协同效应角度揭示化学机械磨削机理，有助于从材料去除机理、磨具结构设计以及复合加工工艺开发等角度创新得到提高该技术加工效率的可行性方法。最后，对化学机械磨削技术在多样化加工对象、较复杂结构加工、多能场复合加工工艺以及智能数据库开发等方向的发展进行了展望。

关键词: 化学机械磨削, 硬脆材料, 磨削机理, 专用磨具