Abstract:

Hot embossing process of the devices with both concave microchannel and convex micro energy director for ultrasonic bonding was researched. Based on the constitutive relation and temperature-depending mechanical properties of the material, commercial software was redeveloped. FEM was employed to simulate the embossing processes with different embossing temperatures. The influences of temperature and holding time on replication accuracy was analyzed with strictly defined embossing force. And the processing parameters were optimized. A silicon mold fabricated by multi-step lithography technology and two times of wet-etching processes was used in the hot embossing experiment. The experiments agree well with the simulation results.

Key words: microfluidic chip, ultrasonic bonding, energy director, finite element method(FEM)

摘要：

研究了热压法制作带有导能筋的新型凸凹微结构的成形特性。从理论出发对材料的本构关系及其温变特性进行了表征,通过对商用软件的二次开发实现了成形特性理论模型的应用,利用有限元法对带有导能筋的基片的热压过程进行仿真,分析了在压力受到严格限制的情况下热压温度以及保温保压时间对复制精度的影响，在此基础上优化了工艺参数。利用套刻法和各向异性湿法腐蚀技术制得所需的硅模具，进行了热压试验，试验结果验证了仿真结果的有效性。

关键词: 微流控芯片, 超声波键合, 导能筋, 有限元法