[1]苏良碧,徐军,杨卫桥,董永军,周国清.氟化钙晶体的生长和应用研究[J].硅酸盐学报,2003,31(12):1202-1207.
[2]Angela D, Roland T, Norbert K, et al. Surface Finish and Optical Quality of CaF2 for UV--lithography Applications[J]. Proc. of SPIE, 1998, 3334: 1048- 1054.
[3]Li X P, He T, Rahman M. Tool Wear Characteris- tics and Their Effects on Nanoscale Ductile Mode Cutting of Silicon Wafer[J]. Wear, 2005, 259 : 1207 -1214.
[4]葛英飞[1],徐九华[2],杨辉[3].SiCp/Al复合材料的超精密车削试验[J].光学精密工程:1621-1629.
[5]宗文俊[1],孙涛[1],李旦[1],董申[1],程凯[1].超精密切削单晶硅的刀具磨损机理[J].纳米技术与精密工程:270-274.
[6]Li H Z, Zeng H, Chen X Q. An Experimental Study of Tool Wear and Cutting Force Variation in the End Milling of Inconel 718 with Coated Carbide In- serts[J]. Journal of Materials Processing Technolo- gy, 2006, 180:296-304.
[7]Polini W,Turchetta S. Evaluation of Diamond Tool Wear[J]. Int. Adv. Manu. Technol., 2005,26: 959-964.
[8]Caprino G, Iorio I D, Nele L, et al. Effect of Tool Wear on Cutting Forces in the Orthogonal Cutting of Unidirectional Glass Fibre--reinforced Plastics [J]. Composites Part, 1996,27:409-415.
[9]Yan J W, Katsuo S, Jun'iehi T. Crystallographic Effects in Nanomachining of Single--crystal Calci- um Fluoride[J]. J. Vac. Sci. Teehnol. B, 2004, 22(1) :46-51.
[10]Marvin J W. Handbook of Optical Materials[M]. NewYork.. CRC Press LLC, 2002.
[11]Liu K,Li X P,Liang S Y. The Mechanism of Duc- tile Chip Formation in Cutting of Brittle Materials [J].Int. J. Adv. Manuf. Technol. ,2007,33:875- 884. |