弯曲半径对柔性电子器件层间分离的影响

中国机械工程

弯曲半径对柔性电子器件层间分离的影响

汤朋朋1; 温雯1;黄永安2;刘谦1

1.中国工程物理研究院总体工程研究所，绵阳， 621900
2.华中科技大学数字制造装备与技术国家重点实验室，武汉， 430074

出版日期:2017-10-10 发布日期:2017-10-10

Influences of Bending Radius on Delamination of Flexible Electronic Devices

TANG Pengpeng1;WEN Wen1;HUANG Yongan2;LIU Qian1

1.Institute of Systems Engineering, China Academy of Engineering Physics (CAEP), Mianyang,Sichuan,621900
2.State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan,430074

Online:2017-10-10 Published:2017-10-10

摘要/Abstract

摘要：

根据欧拉梁理论建立了多层柔性电子器件变形弯曲下能量释放率的数学计算模型，得到了给定条件下能量释放率与半径的关系式，并利用虚拟裂纹闭合法对理论模型进行了验证，进一步分析了弯曲半径对给定器件粘结层分离的影响。该研究为防止器件失效提供了理论参考，对柔性电子器件制造及应用具有参考意义。

关键词: 柔性电子器件;弯曲半径, 能量释放率, 虚拟裂纹闭合法

Abstract: A mathematical model for calculating the ERR of flexible electronic devices under conformal bending was established with Bernoulli-Euler beam theory. Expressions were given to describe the relationship between the bending radius and the energy release rate. For comparison, the ERR was also computed using the VCCT. Influences of bending radius on the delamination of flexible electronic devices were then uncovered.The results of the paper are of great reference value to the flexible electronics manufacturing and applications.

Key words: flexible electronic device, bending radius, energy release rate(ERR), virtual crack closure technique(VCCT)

中图分类号:

TH123

汤朋朋1; 温雯1;黄永安2;刘谦1. 弯曲半径对柔性电子器件层间分离的影响[J]. 中国机械工程.

TANG Pengpeng1;WEN Wen1;HUANG Yongan2;LIU Qian1. Influences of Bending Radius on Delamination of Flexible Electronic Devices[J]. China Mechanical Engineering.

参考文献

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