化学机械抛光中磨粒运动特性离散元仿真研究

中国机械工程 ›› 2011, Vol. 22 ›› Issue (5): 597-603.

化学机械抛光中磨粒运动特性离散元仿真研究

谭援强;张浩;李明军

湘潭大学,湘潭,411105

出版日期:2011-03-10 发布日期:2011-03-24
基金资助:
国家自然科学基金资助项目(50875224)；教育部新世纪人才项目(NCET:06-0708)；教育部博士学科点专项科研基金资助项目(20070530003)
National Natural Science Foundation of China（No. 50875224）;

Program for New Century Excellent Talents in University of Ministry of Education of China（No. NCET:06-0708）;
Project supported by the Specialized Research Fund for the Doctoral Program of the Ministry of Education of China (No. 20070530003 )

Modeling and Simulation of Abrasive Flow in Chemical Mechanical Polishing Using Discrete Element Method

Tan Yuanqiang;Zhang Hao;Li Mingjun

Xiangtan University,Xiangtan,Hunan,411105

Online:2011-03-10 Published:2011-03-24
Supported by:

National Natural Science Foundation of China（No. 50875224）;

Program for New Century Excellent Talents in University of Ministry of Education of China（No. NCET:06-0708）;
Project supported by the Specialized Research Fund for the Doctoral Program of the Ministry of Education of China (No. 20070530003 )

摘要/Abstract

摘要：

基于耦合计算流体力学和计算散体力学的方法,利用PFC3D软件模拟了复合磨粒抛光液化学机械抛光(CMP)中抛光液固液两相流的流动行为。通过2个数值实验并将其与他人实验数据进行对比,验证了利用PFC3D软件模拟纳米两相流问题的可行性。对CMP过程进行了数值模拟,解释了一些实验中观测到的现象。



关键词:

离散元法, 化学机械抛光, 磨粒流, 数值模拟, 复合磨粒

Abstract:

According to coupling computational fluid dynamics and computational granular media mechanics method, the motion of abrasive flow in CMP with composite particles was simulated using discrete element method. With PFC3D software, a two-phase flow model that predicted the kinematics and trajectory of the abrasive particles was built herein,two verification simulations were conducted to demonstrate the capability of the current method to solve nano-size two-phase flow problems. Finally, the CMP geometry simulations were conducted, some phenomenon observed in the experiments

were explained. 

Key words:

discrete element method, chemical mechanical polishing(CMP), abrasive flow, numerical simulation, composite particle

中图分类号:

TH16

谭援强, 张浩, 李明军.

化学机械抛光中磨粒运动特性离散元仿真研究

[J]. 中国机械工程, 2011, 22(5): 597-603.

TAN Huan-Jiang, ZHANG Gao, LI Meng-Jun.

Modeling and Simulation of Abrasive Flow in Chemical Mechanical Polishing Using Discrete Element Method

[J]. China Mechanical Engineering, 2011, 22(5): 597-603.

参考文献

[1]Xu Jin, Luo Jianbin, Lu Xinchun, et al. Progress in Material Removal Mechanisms of Surface Polishing with Ultra Precision [J]. Chinese Sei. Bulletin, 2004,49(16) :1687-1693.
[2]Nakamura T, Akamastu K, Arakawa N. A Bowl Feed and Double Sides Polishing for Silicon Wafer for VLSI[J]. Bull Japan Soc. of Prec. Eng. , 1985, 19(2): 125-135.
[3]Sundararajan S,Thakurta G D, Schwendendeman D W, et al. Two-dimensional Wafer-scale Mechanical Planarization Model Based on Lubrication Theory and Mass Transport[J]. Journal of the Electrochemical Society, 1999,46(2):761-766.
[4]Luo J F. Effects of Abrasive Size Distribution in Chemical Mechanical Planarization: Modeling and Verification [C]//IEEE Trans. on Semiconductor Manufacturing, 2003,16 (3) :469-476.
[5]Zettner C M, Yoda M. Direct Visualization of Parti cle Dynamics in Model CMP Geometries[C]//Pro ceeding of Materials Research Society Symposium Pittsburgh,PA,2001: M6. 6.1-M6. 6. 6.
[6]Terrell E J, Higgs C F. A Modeling Approach for Predicting the Abrasive Particle Motion during Chemical Mechanical Polishing[J]. Journal of Tribology, 2007,129(4) : 933-941.
[7]Terrell E J, Higgs C F. A Particle-augmentedMixed Lubrication Modeling Approach to Predicting Chemical Mechanical Polishing[J]. Journal of Tribology,2009,131 (1) :012201-10.
[8]Zhang Hao,Tan Yuanqiang,Li Mingjun. A Numerical Simulation of Motion of Particles under the Wafer in CMP[C]//2008 International Conference on Computer Science and Software Engineering. Wuhan, China, 2008:31-34.
[9]谭援强张浩李明军.利用三维格子Boltzmann法研CMP中压力分布.润滑与密封,:18-22.
[10]Armini S,Whelan C M,Maexb K,et al. Composite Polymer-core Silica-shell Abrasive Particles during Oxide CMP: a Defectivity Study[J]. Journal of the Electrochemical Society, 2007,154(8) : H667 -H671.
[11]Anderson T B,Jackson R. A Fluid Mechanical Description of Fluidized Beds. Equations of Motion[J]. Industrial and Engineering Chemistry Funda mental, 1967,6(4) : 527-539.
[12]Cundall P A. A Computer Model for Simulating Progressive Large Scale Movements in Blocky System[C]//Proc. Symp. Int. Soc. Rock Mechanics. Rotterdam,1971:8-12.
[13]Haosheng C, Jiang L, Darong C, et al. Nano Particles's Behavior in Non-Newtonian Slurry in Mechanical Process of CMP[J]. Tribology Letters,2006,24(3) :179-186.
[14]Di Felice R. The Voidage Function for Fluid-particle Interaction Systems[J]. International Journal on Multiphase Flow, 1994,20(1) :153-159.
[15]Shapley N C, Armstrong R C, Brown R A. Laser Doppler Velocimetry Measurements of Particle Velocity Fluctuations in a Concentrated Suspension [J]. Journal of Rheology, 2002,46 ( 1 ) : 241-272.
[16]闫晶[1],雒建斌[1],徐学锋[1].纳米颗粒固液二相流实时观测[J].纳米技术与精密工程,2005,3(2):117-121.