Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian,Liaoning, 116024
The advances of surface grinding technology and grinder of silicon wafers were introduced based on the development of silicon wafers. The grinding principles and the characteristics of representative grinders widely using for silicon wafer grinding technologies, i.e., rotary table grinding, wafer rotation grinding, and double-side grinding, were comparatively analyzed. The latest advances of low-damage grinding technologies for silicon wafers back thinning and planarization were discussed and the trend of the wafer grinding technology was prospected.
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2010, Vol. 21 
