关键词: 分布矩阵, 有限元仿真, 多芯片组件, 热设计

Abstract:

Based on the matrix arrangement of  the main power devices on the substrate the paper proposed an idea——MD method.MD method described a basic approach which was established through finite element simulation and was similar to the distribution matrix of MCM chipset.Using Icepak thermal design
software,the shape and the size of the matrix-distribution and the distribution of the chip position in the matrix were further simulated.Finally,the paper
 comes to the conclusion of the matrix-distribution, which is suitable for ventilated heat modalities and rule-substrates,then provides an appropriate
application scope of MD method.

Key words: matrix-distribution(MD), finite element simulation, multi-chip module(MCM), thermal design