关键词: 微机电系统封装, 热失配, 结构稳定性, 黏附

Abstract:

MEMS devices with movable structures can be influenced by unmatched stress introduced by packaging process, leading to the change of structural reliability. The packaging effects on stability of MEMS structures were studied, and structural unstablity behaviors,such as buckling and adhesion, were observed after packaging. Analytical models of vibration and adhesion of beam structure were set up to predict the unstable behaviors. Experiments on surfaced-micromachined polysilicon structures indicate that compression stress is introduced after bonding, and the resonant frequency and contact resistance change considerably after the stability of devices is changed.

Key words: MEMS packaging, thermal mismatch, structural stability, adhesion