电火花, 高阻硅, 机械振动, 穿孔加工, 高深径比

Micro-hole EDM technology on high resistance semiconductor silicon was carried out herein. Through attaching mechanical vibration to a piece of silicon, the efficiency of perforation under the conditions of different amplitudes and frequencies was studied. Experiments show that with the larger amplitude, EDM efficiency first increases and then reduces; as the frequency becomes larger, the efficiency of perforation improves gradually. The reasons are that:the larger amplitude, the better the chip removal, the lower the short-circuit rate, the higher the discharge rate. However, when the amplitude is greater than the discharge gap, the silicon hits with the tool electrode directly, the discharge rate declines. On the other hand, the larger the frequency, the higher the pulse utilization rate. At last, a hole whose diameter is 0.3mm and the ratio of depth to diameter is 25.3 and a equilateral triangle hole whose side is 0.9mm were achieved on P-type silicon whose resistivity is 2.1Ω · cm.