工程陶瓷边缘碎裂行为与机理研究进展

中国机械工程 ›› 2010, Vol. 21 ›› Issue (1): 114-119.

工程陶瓷边缘碎裂行为与机理研究进展

唐修检;田欣利;吴志远;杨俊飞;张宝国

装甲兵工程学院装备再制造技术国防科技重点实验室，北京，100072

出版日期:2010-01-10 发布日期:2010-01-22
基金资助:
国防“十一五”预研项目(51318020208)
National Defense Pre-research Foundation of General Armament Department（No. 51318020208）

Research Progresses on Behavior and Mechanism of Edge Chipping for Engineering Ceramics

Tang Xiujian;Tian Xinli;Wu Zhiyuan;Yang Junfei;Zhang Baoguo

National Key Laboratory for Remanufacturing，Academy of Armored Forces Engineering，Beijing,100072

Online:2010-01-10 Published:2010-01-22
Supported by:
National Defense Pre-research Foundation of General Armament Department（No. 51318020208）

摘要/Abstract

摘要：

边缘碎裂是工程陶瓷磨削加工过程中的常见现象，是影响陶瓷元件加工质量和加工成本的关键因素之一。由于所处几何位置的特殊性，传统陶瓷磨削理论难以直接解释边缘碎裂行为的特有现象及规律，研究陶瓷等脆性材料的边缘碎裂行为与机理成为当今加工界的热点之一。综述了工程陶瓷边缘碎裂行为与机理的最新研究进展，详细阐述了工程陶瓷的边缘碎裂剥落模型、边缘碎裂单晶压头模型和边缘碎裂划痕模型，并对各模型的优缺点作了评价，提出了工程陶瓷边缘碎裂行为与机理研究中尚待解决的问题以及边缘碎裂预防措施。

关键词:

工程陶瓷, 边缘碎裂, 断裂机理, 碎裂模型

Abstract:

Edge chipping is a phenomenon commonly observed during the machining process of ceramic material, and which is one of the key factors deciding the qualities and costs of ceramic components. Traditional ceramic grinding theories are difficult to explain the characteristic phenomenon and regulars of edge chipping for its special geometric location, the research of its behavior and mechanism has become focus work in recent years. Recent research progresses of behavior and mechanism about edge chipping were summarized, and edge spalling model, edge chipping by single indenter and edge chipping by scratch test were introduced, all of the merits and defects of them were evaluated, some issues need to be solved for them and some methods to prevent it taking place were presented.

Key words: engineering ceramics, edge chipping, fracture mechanism;fragmentation model

中图分类号:

TH306

唐修检, 田欣利, 吴志远, 杨俊飞, 张宝国.

工程陶瓷边缘碎裂行为与机理研究进展

[J]. 中国机械工程, 2010, 21(1): 114-119.

TANG Xiu-Jian, TIAN Xin-Li, TUN Zhi-Yuan, YANG Dun-Fei, ZHANG Bao-Guo.

Research Progresses on Behavior and Mechanism of Edge Chipping for Engineering Ceramics

[J]. China Mechanical Engineering, 2010, 21(1): 114-119.

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