中国机械工程 ›› 2010, Vol. 21 ›› Issue (04): 446-451.

• 信息技术 • 上一篇    下一篇

倒装焊封装对MEMS器件性能影响的有限元分析研究

魏松胜;唐洁影;宋竞
  

  1. 东南大学MEMS教育部重点实验室,南京,210096
  • 出版日期:2010-02-25 发布日期:2010-03-10
  • 基金资助:
    武器装备预先研究资助项目;国家863高技术研究发展计划资助项目(2007AA04Z320) 
    National Defense Pre-research Foundation of General Armament Department;
    National High-tech R&D Program of China (863 Program) (No. 2007AA04Z320)

FEM Study of Effect of Flip Chip Packaging on MEMS Performance

Wei Songsheng;Tang Jieying;Song Jing
  

  1. Key Laboratory of Micro-Electro-Mechanical System of Ministry of Education,Southeast University,Nanjing,210096
  • Online:2010-02-25 Published:2010-03-10
  • Supported by:
     
    National Defense Pre-research Foundation of General Armament Department;
    National High-tech R&D Program of China (863 Program) (No. 2007AA04Z320)

摘要:

对2×2、4×4、6×6、8×8面阵列凸点分布形式的倒装芯片分别进行了建模和模拟,分析了面阵列倒装芯片在常规温度载荷下芯片表面应力分布和变形的一般规律,并分析比较了凸点分布形式、基板类型对面阵列倒装芯片表面应力分布的影响,在此基础上估算了应力和变形对典型MEMS器件的影响。对于常规4×4面阵列情况,倒装焊后的悬臂梁吸合电压的最大相对变化率为5%,而固支梁一阶固有谐振频率最大相对变化率为110%。

关键词:

Abstract:

Flip chip packages with area array patterns of 2×2,4×4,6×6,8×8 bumps were investigated using finite element method.The stress distribution and warpage of the flip chip were simulated with respect to different bump patterns.The stress and warpage can lead to a maximum relative change of 5% in the pull-in voltage of a microcantilever and 110% in the first natural frequency of a microbridge after flip chip packaging.

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