中国机械工程 ›› 2023, Vol. 34 ›› Issue (21): 2531-2539.DOI: 10.3969/j.issn.1004-132X.2023.21.002

• 机械基础工程 • 上一篇    下一篇

精密电铸模芯厚度均匀性的调控

杨忠豪1,2;蒋炳炎1,2;马志高1,2;杨迪1,2;张露1,2   

  1. 1.中南大学机电工程学院,长沙,410083
    2.极端服役性能精准制造全国重点实验室,长沙,410083
  • 出版日期:2023-11-10 发布日期:2023-11-29
  • 通讯作者: 张露(通信作者),男,1990年生,副教授。研究方向为聚合物微系统设计及制造、精密注射成形、电化学加工。发表论文30余篇。E-mail:zhangl@csu.edu.cn。
  • 作者简介:杨忠豪,男,1998年生,硕士研究生。研究方向为微电铸成形。E-mail:2311046330@qq.com。
  • 基金资助:
    国家自然科学基金(51920105008)

Adjustment of Thickness Uniformity for Precision Electroformed Mold Insert

YANG Zhonghao1,2;JIANG Bingyan1,2;MA Zhigao1,2;YANG Di1,2;ZHANG Lu1,2   

  1. 1.School of Electrical and Mechanical Engineering,Central South University,Changsha,410083
    2.State Key Laboratory of Precision Manufacturing for Extreme Service Performance,
    Changsha,410083
  • Online:2023-11-10 Published:2023-11-29

摘要: 阴极边缘的电场分布不均匀导致模芯边缘的沉积速率高,严重降低电铸模芯的厚度均匀性。在屏蔽挡板工艺基础上,创新性地设计了具有侧边凹槽的阴极夹具。研究表明,沉积层厚度为0.1 mm时,采用该阴极夹具,在屏蔽挡板情况下的厚度不均匀性仅为4.3%,在无屏蔽挡板情况下的厚度不均匀性为16.5%。基于屏蔽挡板和侧边凹槽屏工艺,电铸成形了厚度1.1 mm、不均匀性小于8.0%的精密注射模芯。

关键词: 电铸, 厚度不均匀性, 屏蔽挡板, 侧边凹槽, 注射模芯

Abstract: In electroforming processes, the nonuniform distribution of electric field at cathode edge led to a higher deposition rate at the edge, which resulted in the nonuniform thickness of electroformed mold insert. A cathode fixture with side grooves on top of the shielding baffle was designed herein. The research results show that the nonuniformity is as 4.3% with the thickness of electrodeposited layer is as 0.1 mm, which is the 16.5% of the nonuniformity without shielding plate. The precision injection mold insert with a thickness of 1.1 mm and thickness nonuniformity less than 8% was successfully fabricated based on the cathode side groove and shielding baffle. 

Key words:  , electroforming, thickness nonuniformity, shielding baffle, cathode side groove, injection mold insert

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