Abstract:  In order to solve the problems of edge chipping and cracking in the machining of SiC ceramics， a combination of simulation and experiment was used to study the technology of grinding holes in the rotary ultrasonic vibration trepanning drilling. According to the macroscopic mechanics constitutive model of SiC ceramics， the finite element models for the SiC ceramic hole making simulation were established and the simulation analysis of the machining processes was carried out. Compared with the conventional hole making， the simulation axial forces of the ultrasonic vibration hole making may be reduced by 26.1%. The comparative experimental study of conventional machining and ultrasonic vibration machining shows that rotary ultrasonic vibration machining may reduce the axial force by 32.9%， greatly reduce the brittle fracture of ceramic materials， and significantly improve the surface quality of the hole walls. Under ultrasonic vibration conditions， the maximum difference between the axial force values obtained by finite element simulation and experimental research is as 7.5%， and the maximum difference under normal conditions is as 14%， which verifies the correctness of the finite element model. Simulation and experimental results show that ultrasonic vibration machining may significantly reduce axial forces and tool wear， improve tool durability， improve hole quality， and save machining costs. 

Key words: SiC ceramic, rotating ultrasonic vibration, trepanning grinding hole, finite element simulation

摘要： 为解决SiC陶瓷加工时容易出现崩边、裂纹等问题，结合仿真与实验对其进行旋转超声振动套磨制孔技术研究。根据SiC陶瓷宏观力学本构模型，建立SiC陶瓷制孔仿真有限元模型并进行加工过程仿真分析，相比常规制孔，超声振动制孔的仿真轴向力最大可减小26.1%。常规加工和超声振动加工的对比实验研究表明，旋转超声振动加工可减小轴向力达32.9%，可大幅减少陶瓷材料脆性断裂，显著改善孔壁表面质量。有限元仿真与实验研究所得的轴向力在超声振动下最大相差7.5%，常规条件下两者最大相差14%，验证了有限元模型的正确性。仿真和实验研究结果表明：超声振动加工可显著减小轴向力和刀具磨损、提高刀具耐用度、改善制孔质量、降低加工成本。

关键词: SiC陶瓷, 旋转超声振动, 套磨制孔, 有限元仿真