Abstract:

Based on the matrix arrangement of  the main power devices on the substrate the paper proposed an idea——MD method.MD method described a basic approach which was established through finite element simulation and was similar to the distribution matrix of MCM chipset.Using Icepak thermal design
software,the shape and the size of the matrix-distribution and the distribution of the chip position in the matrix were further simulated.Finally,the paper
 comes to the conclusion of the matrix-distribution, which is suitable for ventilated heat modalities and rule-substrates,then provides an appropriate
application scope of MD method.

Key words: matrix-distribution(MD), finite element simulation, multi-chip module(MCM), thermal design

摘要：

基于矩阵的思想提出了一种在基板上排布主要功耗器件的矩阵方法——分布矩阵法(MD法)。
分布矩阵法描述了利用有限元仿真法建立的,类似于多芯片组件芯片组的分布矩阵基本方法。以风冷散热为载体，利用Icepak热设计软件对分布矩阵的形状、尺寸以及芯片在矩阵中的分布位置进行了进一步的仿真验证。最后得出了一种适用于风冷散热方式、规则基板的分布矩阵，并给出了它相应的适用范围。

关键词: 分布矩阵, 有限元仿真, 多芯片组件, 热设计