SiC硬脆材料纳米切削的亚表层损伤与塑性去除机理探析
陈晶晶, 陈莎, 朱海燕, 袁军军, 罗泽宇
Mechanism Analysis of Material Remove and Subsurface Layer Damages for SiC during Nanocutting Processes
Jingjing CHEN, Sha CHEN, Haiyan ZHU, Junjun YUAN, Zeyu LUO
中国机械工程
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2025, (10): 2312
-2321
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DOI: 10.3969/j.issn.1004-132X.2025.10.019
