参数对均匀微滴打印多尺寸锡焊料凸点阵列的影响
高昆, 黎映相, 齐乐华, 吴浪, 周怡, 豆毅博, 罗俊
Influences of Parameters on Multi-Size Tin Solder Bump Array Printed by Uniform Micro Droplets
GAO Kun, LI Yingxiang, QI Lehua, WU Lang, ZHOU Yi, DOU Yibo, LUO Jun
中国机械工程
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2021, (19): 2367
-2373
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DOI: 10.3969/j.issn.1004-132X.2021.19.012
