集成电路芯片制造中电化学机械平整化技术的研究进展

翟文杰;梁迎春

Research Progresses on Electro-chemical Mechanical Planarization(ECMP) in the Fabrication of Integrated Circuit Wafers

Zhai Wenjie;Liang Yingchun

J4 . 2008, (4): 0 -503 .