带有凸凹微结构的微流控基片热压成形特性研究
张宗波, 吴宝贵, 贺庆强, 罗怡, 王晓东, 王立鼎
Research on Hot Embossing Process of Microfluidic Substrates with Both Convex and Concave Microstructures
Zhang Zongbo, Wu Baogui, He Qingqiang, Luo Yi, Wang Xiaodong, Wang Liding
中国机械工程
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2014, (16): 2231
-2234,2239
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