<div>CMP过程磨粒压入芯片表面深度的影响因素分析</div>

蒋建忠1, 袁晓林2, 赵永武1

Factors Influencing Indentation Depth of a Particle into Wafer Surface in CMP

JIANG Jian-Zhong-1, YUAN Xiao-Lin-2, DIAO Yong-Wu-1

中国机械工程 . 2011, (15): 1783 -1787 .